Feed forward test methodology utilizing device identification

In this paper, we present applications and results for adapted testing at package test utilizing part specific data collected at wafer test. Using unique die level identification we are able to define part specific binning, and parametric limits based on analysis of prior test results and feed this forward to package test. This die level identification technique applied to any parametric tests where data is collected at both wafer sort and final test or during reliability testing at multiple read points. This method improves our resolution to detect shifts. It eliminates the additional noise associated with comparing a die to a historical distribution instead the die is compared directly ti itself at some previous read point using a unique die ID.

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