论文信息 - Flip Chip Assembly of Thin Substrates, Fine Bump Pitch, and Small Area Prototype Die - 字舞流文

Flip Chip Assembly of Thin Substrates, Fine Bump Pitch, and Small Area Prototype Die

B. Markovic | A. Tomada | J. Hasi | P. Caragiulo | Julie D. Segal | Gabriella Carini | G. Blaj | A. Dragone | Julie D. Segal | Sven C. Herrmenn | Christopher J. Kenney | K. Nishimura | K. Nishimura