Physics-of-Failure Approach to PHM

[1]  Xing Wu,et al.  Resilience of ultra-thin oxynitride films to percolative wear-out and reliability implications for high-κ stacks at low voltage stress , 2013 .

[2]  Y. Q. Chen,et al.  Design of prognostic circuit for electromigration failure of integrated circuit , 2013, Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

[3]  K. Pey,et al.  Stress migration risk on electromigration reliability in advanced narrow line copper interconnects , 2011 .

[4]  Michael Osterman,et al.  Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board , 2006 .

[5]  Michael G. Pecht,et al.  Creep fatigue models of solder joints: A critical review , 2016, Microelectron. Reliab..

[6]  Michael Osterman,et al.  Prognostics of lithium-ion batteries based on DempsterShafer theory and the Bayesian Monte Carlo me , 2011 .

[7]  D. L. Goodman.  Prognostic methodology for deep submicron semiconductor failure modes , 2001 .

[8]  Hui Huang,et al.  A Lifetime Estimation Technique for Voltage Source Inverters , 2013, IEEE Transactions on Power Electronics.

[9]  Paul S. Ho,et al.  Direct observation of a critical length effect in dual-damascene Cu/oxide interconnects , 2001 .

[10]  Bongtae Han,et al.  Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review , 2015, IEEE Transactions on Power Electronics.

[11]  Jie Gu,et al.  Prognostics implementation of electronics under vibration loading , 2007, Microelectron. Reliab..

[12]  C. M. Johnson,et al.  Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules , 2013, IEEE Transactions on Device and Materials Reliability.

[13]  John S. de Coutinho,et al.  DIVISION OF ENGINEERING: FAILURE‐EFFECT ANALYSIS* , 1964 .

[14]  Chris Bailey,et al.  Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules , 2014, Microelectron. Reliab..

[15]  Michael Pecht,et al.  A life consumption monitoring methodology for electronic systems , 2003 .

[16]  J. Stathis,et al.  Dielectric breakdown mechanisms in gate oxides , 2005 .

[17]  Dawn An,et al.  Prognostics 101: A tutorial for particle filter-based prognostics algorithm using Matlab , 2013, Reliab. Eng. Syst. Saf..

[18]  D. Goodman,et al.  A board-level prognostic monitor for MOSFET TDDB , 2006, 2006 IEEE Aerospace Conference.

[19]  Michael Osterman,et al.  Physics-of-failure (PoF) methodology for electronic reliability , 2015 .

[20]  M.G. Pecht,et al.  Prognostics and health management of electronics , 2008, IEEE Transactions on Components and Packaging Technologies.

[21]  Nagarajan Raghavan,et al.  High-κ dielectric breakdown in nanoscale logic devices - Scientific insight and technology impact , 2014, Microelectron. Reliab..

[22]  Michael Pecht,et al.  In-situ sensors for product reliability monitoring , 2002, Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS.

[23]  Sebastian K. Fixson,et al.  Product architecture assessment: a tool to link product, process, and supply chain design decisions , 2005 .

[24]  Chao Wang,et al.  A new creep-fatigue life model of lead-free solder joint , 2015, Microelectron. Reliab..

[25]  Michael Pecht,et al.  Failure Precursors for Polymer Resettable Fuses , 2010, IEEE Transactions on Device and Materials Reliability.

[26]  Y. Q. Chen,et al.  A prognostic circuit for time-dependent dielectric breakdown failure of MOSFET , 2014, 2014 10th International Conference on Reliability, Maintainability and Safety (ICRMS).

[27]  D. J. Lawson,et al.  Failure Mode, Effect and Criticality Analysis , 1983 .

[28]  John Bowles,et al.  An assessment of RPN prioritization in a failure modes effects and criticality analysis , 2003, Annual Reliability and Maintainability Symposium, 2003..

[29]  M. Pecht,et al.  Physics-of-Failure-Based Prognostics and Health Management for High-Power White Light-Emitting Diode Lighting , 2011, IEEE Transactions on Device and Materials Reliability.

[30]  M.G. Pecht,et al.  In situ temperature measurement of a notebook computer - a case study in health and usage monitoring of electronics , 2004, IEEE Transactions on Device and Materials Reliability.

[31]  J. McPherson,et al.  Thermochemical description of dielectric breakdown in high dielectric constant materials , 2003 .

[32]  Michael Pecht,et al.  A failure modes, mechanisms, and effects analysis (FMMEA) of lithium-ion batteries , 2015 .