论文信息 - Gold-Tin Solder Wetting Behavior for Package Lid Seals - 字舞流文

Gold-Tin Solder Wetting Behavior for Package Lid Seals

Alice C. Kilgo | Paul T. Vianco | Bonnie M. McKenzie

[1] Antti Rautiainen,et al. Optimization of contact metallizations for reliable wafer level AuSn bonds , 2016, Microelectron. Reliab..

[2] P. Holmes,et al. Handbook of thick film technology , 1976 .

[3] Chun-Kai Liu,et al. Au–Sn bonding material for the assembly of power integrated circuit module , 2016 .

[4] Douglas G. Ivey,et al. Microstructural characterization of Au/Sn solder for packaging in optoelectronic applications , 1998 .

[5] Chin C. Lee,et al. AuSn alloy phase diagram and properties related to its use as a bonding medium , 1993 .

[6] P. Hadley,et al. Reaction dynamics of diffusion soldering with the eutectic Au–Sn alloy on copper and silver substrates , 2012 .

[7] H. Berg,et al. Properties of Die Bond Alloys Relating to Thermal Fatigue , 1979 .

[8] P. Vianco. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance , 1999 .

[9] I. Christie,et al. Gold electrodeposition within the electronics industry , 1994 .