Advancing the thermal stability of 3D-IC's using logi-thermal simulation

3D-ICs have emerged in the past few years. While they solve a large number of problems related to scaling, they also create new ones. Removing the heat from the layers far from the cooling facilities is a great challenge still under intensive research. This paper shows how logi-thermal simulation can be used to predict the operation parameters of large digital systems realized in 3D-ICs. The method can be effectively used to guide place-and-route algorithms and to find the thermal bottlenecks.

[1]  Yici Cai,et al.  Thermal-aware P/G TSV planning for IR drop reduction in 3D ICs , 2013, Integr..

[2]  Dennis Saleh.  Zs , 2001 .

[3]  M. Rencz,et al.  Electro-thermal and Logi-thermal Simulators aimed at the Temperature-aware Design of Complex Integrated Circuits , 2008, 2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

[4]  Volkan Kursun,et al.  Reversed Temperature-Dependent Propagation Delay Characteristics in Nanometer CMOS Circuits , 2006, IEEE Transactions on Circuits and Systems II: Express Briefs.

[5]  Gábor Hosszú,et al.  A Proposed Novel Description Language in Digital System Modeling , 2015 .

[6]  Ali Dasdan,et al.  Handling inverted temperature dependence in static timing analysis , 2006, TODE.

[7]  Narayanan Vijaykrishnan,et al.  Interconnect and thermal-aware floorplanning for 3D microprocessors , 2006, 7th International Symposium on Quality Electronic Design (ISQED'06).

[8]  Dick James.  3D ICs in the real world , 2014, 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014).

[9]  N. Kernevez,et al.  Challenges for 3D IC integration: bonding quality and thermal management , 2007, 2007 IEEE International Interconnect Technology Conferencee.

[10]  András Timár,et al.  Real-time heating and power characterization of cells in standard cell designs , 2013, Microelectron. J..

[11]  An-Yeu Wu,et al.  Traffic- and Thermal-Aware Run-Time Thermal Management Scheme for 3D NoC Systems , 2010, 2010 Fourth ACM/IEEE International Symposium on Networks-on-Chip.

[12]  András Timár,et al.  Temperature dependent timing in standard cell designs , 2012, 18th International Workshop on THERMal INvestigation of ICs and Systems.

[13]  Bart Vandevelde,et al.  Fine grain thermal modeling and experimental validation of 3D-ICs , 2011, Microelectron. J..

[14]  J. Lau.  Evolution, challenge, and outlook of TSV, 3D IC integration and 3d silicon integration , 2011, 2011 International Symposium on Advanced Packaging Materials (APM).

[15]  H. C. Cheng,et al.  Micro bridge technology for 3D-IC interconnection could benefit the 3D-IC test strategy , 2012, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

[16]  A. Timar,et al.  Yield enhancement by logi-thermal simulation based testing , 2012, 18th International Workshop on THERMal INvestigation of ICs and Systems.

[17]  Gábor Takács,et al.  Improved thermal characterization method of integrated microscale heat sinks , 2014, Microelectron. J..

[18]  Vladimír Székely,et al.  Fast field solver for the simulation of large-area OLEDs , 2010, Microelectron. J..

[19]  Yu Wang,et al.  Three-dimensional integrated circuits (3D IC) Floorplan and Power/Ground Network Co-synthesis , 2010, 2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC).

[20]  Márta Rencz,et al.  Electro-thermal and logi-thermal simulation of VLSI designs , 1997, IEEE Trans. Very Large Scale Integr. Syst..

[21]  Luca Benini,et al.  Design Issues and Considerations for Low-Cost 3-D TSV IC Technology , 2010, IEEE Journal of Solid-State Circuits.

[22]  Gabor Hosszu,et al.  A proposed RTL design technique for highly optimized on-chip data processors of MEMS sensors , 2015, 2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).

[23]  Gábor Hosszú,et al.  A proposed synthesis method for Application-Specific Instruction Set Processors , 2015, Microelectron. J..