Adhesion between template materials and UV-cured nanoimprint resists

The origins of defects in lithographic stencils fabricated by the UV-cure nanoimprint technique include fundamental surface interactions between template and resist in addition to the presence of particles and contaminants. Repeated, molecularly clean separations of the template from the newly cured resist is a requirement, yet rather little is understood about the separation process or underlying interfacial physics and chemistry. We have investigated the chemical and physical interactions of several model acrylate nanoimprint resist formulations cured in contact with clean and release-treated quartz surfaces, then separated from them. The results show that fracture energies are resist formulation-dependent, that the resist-release layer systems studied are not chemically stable and that release process is more complex than simple fracture at a glass-organic interface.

[1]  A. Ulman,et al.  Formation and Structure of Self-Assembled Monolayers. , 1996, Chemical reviews.

[2]  Heinrich Kurz,et al.  Reproducibility and homogeneity in step and repeat UV-nanoimprint lithography , 2004 .

[3]  Bernard Choi,et al.  Step and flash imprint lithography: a new approach to high-resolution patterning , 1999, Advanced Lithography.

[4]  T. Michalske,et al.  Chemical vapor deposition of fluoroalkylsilane monolayer films for adhesion control in microelectromechanical systems , 2000 .

[5]  C. Decker Kinetic Study and New Applications of UV Radiation Curing , 2002 .

[6]  C. Willson,et al.  Step and flash imprint lithography: Template surface treatment and defect analysis , 2000 .

[7]  Michael Lane,et al.  Adhesion and debonding of multi-layer thin film structures , 1998 .

[8]  R Stanley Williams,et al.  Vapor-phase self-assembled monolayer for improved mold release in nanoimprint lithography. , 2005, Langmuir : the ACS journal of surfaces and colloids.

[9]  William J. Dauksher,et al.  Imprint lithography for integrated circuit fabrication , 2003 .

[10]  H. Hiroshima,et al.  Improvement of imprinted pattern uniformity using sapphire mold , 2001, Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468).

[11]  H. Hiroshima,et al.  Measurement of Adhesive Force Between Mold and Photocurable Resin in Imprint Technology , 2001, Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468).

[12]  C. Volpe,et al.  Some Reflections on Acid-Base Solid Surface Free Energy Theories , 1997, Journal of colloid and interface science.