Scalability of Capacitive Hardening for Flip-Flops in Advanced Technology Nodes
暂无分享,去创建一个
L. W. Massengill | B. L. Bhuva | S. Jagannathan | Z. J. Diggins | N. N. Mahatme | T. D. Loveless | S.-J Wen | A. F. Witulski | N. J. Gaspard | R. Wong | L. Massengill | B. Bhuva | Z. Diggins | A. Witulski | N. Mahatme | S. Jagannathan | T. Reece | S. Wen | R. Wong | N. Gaspard | T. R. Reece
[1] A. N. Smirnov,et al. Characterization of the ANITA Neutron Source for Accelerated SEE Testing at the Svedberg Laboratory , 2009, REDW 2009.
[2] P.H. Eaton,et al. Multiple Bit Upsets and Error Mitigation in Ultra-Deep Submicron SRAMS , 2008, IEEE Transactions on Nuclear Science.
[3] B. Narasimham,et al. Characterization of Digital Single Event Transient Pulse-Widths in 130-nm and 90-nm CMOS Technologies , 2007, IEEE Transactions on Nuclear Science.
[4] T. Calin,et al. Upset hardened memory design for submicron CMOS technology , 1996 .
[5] P. Hazucha,et al. Impact of CMOS technology scaling on the atmospheric neutron soft error rate , 2000 .
[6] Shi-Jie Wen,et al. Effects of multi-node charge collection in flip-flop designs at advanced technology nodes , 2010, 2010 IEEE International Reliability Physics Symposium.
[7] R. Allmon,et al. On the radiation-induced soft error performance of hardened sequential elements in advanced bulk CMOS technologies , 2010, 2010 IEEE International Reliability Physics Symposium.
[8] R.C. Baumann,et al. Radiation-induced soft errors in advanced semiconductor technologies , 2005, IEEE Transactions on Device and Materials Reliability.
[9] Marty R. Shaneyfelt,et al. Impact of technology trends on SEU in CMOS SRAMs , 1996 .
[10] G. Gasiot,et al. Impacts of front-end and middle-end process modifications on terrestrial soft error rate , 2005, IEEE Transactions on Device and Materials Reliability.
[11] B. Narasimham,et al. Neutron and alpha particle-induced transients in 90 nm technology , 2008, 2008 IEEE International Reliability Physics Symposium.
[12] J. Ziegler. THE STOPPING AND RANGE OF IONS IN SOLIDS , 1988 .