论文信息 - Development of G-Helix Structure as Off-Chip Interconnect - 字舞流文

Development of G-Helix Structure as Off-Chip Interconnect

Qi Zhu | Suresh K. Sitaraman | Lunyu Ma | S. Sitaraman | Qi Zhu | Lunyu Ma

[1] R. H. Myers,et al. Response Surface Methodology: Process and Product Optimization Using Designed Experiments , 1995 .

[2] Reza Ghaffarian. Chip Scale Package Assembly Reliability , 2001 .

[3] Rao Tummala,et al. Fundamentals of Microsystems Packaging , 2001 .

[4] Chi Shih Chang,et al. Future challenges in electronics packaging , 1998 .

[5] Leon M Keer,et al. Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder , 1992 .