Process window and device variations evaluation using array-based characterization circuits
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B. Wagner | E. Ehrichs | C. Tabery | M. Craig | G. Burbach | S. McGowan | P. Etter | S. Roling | C. Haidinyak | E. Ehrichs | C. Tabery | G. Burbach | S. McGowan | B. Wagner | M. Craig | P. Etter | S. Roling | C. Haidinyak
[1] Daniela De Venuto,et al. International Symposium on Quality Electronic Design , 2005, Microelectron. J..
[2] H. Masuda,et al. Development of a large-scale TEG for evaluation and analysis of yield and variation , 2004, IEEE Transactions on Semiconductor Manufacturing.
[3] J. M. Chen,et al. (IEEE Transactions on Semiconductor Manufacturing,15(1):039-044)Hydrodynamic Characteristics of the Thin Fluid Film in Chemical-Mechanical Polishing , 2002 .