Solder Reliability Solutions: A PC‐based Design‐for‐reliability Tool*

This paper presents a solder joint engineering reliability model — Solder Reliability Solutions** (SRS) — and its application to surface mount area‐array and chip‐scale assemblies. The model is validated by failure data from 33 accelerated thermal cycling tests, and test vehicles covering several generations of component, assembly and circuit board technologies and a variety of test conditions. The SRS model has been implemented as a PC‐based design‐for‐reliabilltytool that enables rapid assessment of assembly reliability in the early stages of product development.

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