히트 싱크 부착 전자 부품을 가진 통신 시스템의 효율적 냉각 방안에 관한 수치적 연구

A numerical study on the effective cooling method for electronic components mounted with heat sink has been performed. The numerical model of electronic system was composed of lower and upper modules in which electronic components mounted with heat sink were arrayed. Four cases considered in present study were no heat sink, both heat sinks, lower heat sinks and upper heat sinks. The results show that temperatures at the surface of electronic component in the both heat sinks were 10% lower than those in the no heat sink at same heat dissipation per a component. Also when temperatures at the surface of electronic component, thermal resistance, and the pressure loss were compared, the upper heat sink had the most effective cooling performance.