Printability of programmed x-ray mask defects

In order to specify the sensitivity of the next generation inspection system, we investigated the printability of x-ray mask defects by using the simulator (Toolset) developed by University of Wisconsin. The defect size replicated in the resist was simulated for various exposure conditions such as exposure gap, mask contrast, and beam blur. The critical dimension (CD) errors due to mask defects were also calculated for the mask defect size, opaque and clear defects, and the mask pattern configuration. Based on these results, the critical size for 100 nm feature line-and-space (L&S) patterns was discussed and the sensitivity of defect inspection system for 100 nm feature L&S patterns is estimated to be at most 40 nm as the critical defect sizes inducing 10 nm CD error.