Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods

Tel: 1-800-Springer, 8:30 am -5:30 pm ET Fax: 1-201-348-4505 Email: orders-ny@springer.com The handbook provides the most comprehensive, up-to-date and easyto-apply information on the physics, mechanics, reliability and packaging of microand opto-electronic materials, assemblies, structures and systems. Each chapter contains a summary of the state-of-the-art in a particular field and practical recommendations on how to apply current knowledge and technology to design, manufacture and operate a viable, reliable and cost-effective electronic component or photonic device, and on how to make such a device into a successful commercial product. The handbook can be used as a reference and as a manual for self-education. Designed and written for electrical, materials, mechanical, and reliability engineers, as well as applied physicists and materials scientists this will be an essential reference for all those who are interested in the state-ofthe-art of microand opto-electronic materials, packaging , and reliability, with an emphasis on physical design problems,

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