Effect of grain growth stress and stress gradient on stress-induced voiding in damascene Cu/low-k interconnects for ULSI
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[1] C. J. Smithells,et al. Smithells metals reference book , 1949 .
[2] Herbert Malamud,et al. Landolt-Bornstein: Numerical Data and Functional Relationships in Science and Technology , 1985 .
[3] R. Bechmann,et al. Numerical data and functional relationships in science and technology , 1969 .
[4] William D. Nix,et al. Mechanical properties of thin films , 1989 .
[5] D. R. F. West,et al. Encyclopedia of materials science and engineering , 1989 .
[6] T. Sudarshan,et al. A review of “ Smithells Metals Reference Book, Seventh Edition”Edited by E.A. Brandes and G.B. Brook To obtain contact: Butterworth-Heinemann Linacre House, Jordan Hill, Oxford OX2 8DP. U.K. , 1994 .
[7] Paul A. Flinn,et al. Mechanical Stress in VLSI Interconnections: Origins, Effects, Measurement, and Modeling , 1995 .
[8] R. Reeber,et al. Thermal expansion and lattice parameters of group IV semiconductors , 1996 .
[9] Subra Suresh,et al. Stresses, curvatures, and shape changes arising from patterned lines on silicon wafers , 1996 .
[10] Yu-Lin Shen,et al. VOIDING INDUCED STRESS REDISTRIBUTION AND ITS RELIABILITY IMPLICATIONS IN METAL INTERCONNECTS , 2000 .
[11] Ehrenfried Zschech,et al. Microstructural characterization of inlaid copper interconnect lines , 2001 .
[12] A. ADoefaa,et al. ? ? ? ? f ? ? ? ? ? , 2003 .
[13] R. J. Carter. Materials, technology and reliability for advanced interconnects and low-k dielectrics - 2004 : symposium held April 13-15, 2004, San Francisco, California, U.S.A. , 2004 .
[14] Young-Chang Joo,et al. Effect of dielectric materials on stress-induced damage modes in damascene Cu lines , 2005 .
[15] W. Eccleston,et al. Mater. Res. Soc. Symp. Proc. , 2006 .