Manufacture of Copper Cone Shell Using Electroforming Process and Investigation of Effective Parameters on the Process Using Numerical Simulation *

: http://dx.doi.org/10.22076/me.2017.27135.1030 * Corresponding Author: Reza Roumina, PhD Address: School of Metallurgy and Materials Engineering, University of Tehran, Tehran, Iran. Tel: +98 (21) 82084097 E-mail: roumina@ut.ac.ir Research Paper The Study of Hot Deformation Behavior of an Mg-10Li-1Zn Alloy by Arrhenius Constitutive Equations 1. MSc., School of Metallurgy and Materials Engineering, University of Tehran, Tehran, Iran. 2. Assistant Professor, School of Metallurgy and Materials Engineering, University of Tehran, Tehran, Iran. 3. Professor, School of Metallurgy and Materials Engineering, University of Tehran, Tehran, Iran. Mostafa Shalbafi1, *Reza Roumina2, Reza Mahmudi3 rr s i thor: Hamid Heydari Pebdani, MSc. Student ddress: Department of Chemical and Petroleum Engineering, Sharif University of Technology, Tehran, Iran. Tel: +98 (9139857825) Eail: h.heydari313@yahoo.com Research Paper Manufacture of Copper Cone Shell Using Electroforming Process and Investigation of Effective Parameters on the Process Using Numerical Simulation *Hamid Heydari Pebdani1, Hossein Mehmannavaz2, Gholamhossein Liaghat3, Sadegh Rahmati4, Hamid Fazeli5 1MSc. Student, Department of Chemical and Petroleum Engineering, Sharif University of Technology, Tehran, Iran. 2PhD tudent, D partme t of Mechanical Engineering, Islamic Azad University, Science and Research Branch, Tehran, Iran. 3Professor,D pa tment chanic l Engineering, TarbiatModares Univ rsity, Tehran, Iran. 4Associate Professor, Department of Mecha ical Engi e ring, Islamic Azad University, Science and Research Branch, Tehran, Iran. 5Associate Professor, Department of Mechanical Engineering, Malek-Ashtar University of Technology, Tehran, Iran. Citation: Heydari Pebdani H, Mehmannavaz H, Liaghat Gh, Rahmati S, Fazeli H. Manufacture of Copper Cone Shell Using Electroforming Process and Investigation of Effective Parameters on the Process Using Numerical Simulation. Metallurgical Engineering 2018: 21(3): 198-206 http://dx.doi.org/10.22076/me.2018.84662.1186 doi : http://dx.doi.org/10.22076/me.2018.84662.1186

[1]  Srijan Sengupta,et al.  Substrate effect on electrodeposited copper morphology and crystal shapes , 2018 .

[2]  T. Elshenawy,et al.  Influence of electric current intensity on the performance of electroformed copper liner for shaped charge application , 2017 .

[3]  L. Rajendran,et al.  Non-linear Differential Equations and Rotating Disc Electrodes: Padé approximationTechnique , 2017 .

[4]  Ligen Wang,et al.  Mechanical properties and microstructure of rolled and electrodeposited thin copper foil , 2016, Rare Metals.

[5]  C. Zanella,et al.  Finite element modeling of silver electrodeposition for evaluation of thickness distribution on complex geometries , 2016 .

[6]  W. Lu,et al.  Effect of Electrodeposition Parameters on the Morphology of Three-Dimensional Porous Copper Foams , 2015, International Journal of Electrochemical Science.

[7]  S. A. Dassie,et al.  Determination of flow patterns in a rotating disk electrode configuration by MRI , 2015 .

[8]  S. Caporali,et al.  Finite Elements Analysis of an Electrochemical Coating Process of an Irregularly Shaped Cathode with COMSOL Multiphysics , 2015 .

[9]  Mark Robert Robison,et al.  Modeling and experimental validation of electroplating deposit distributions from copper sulfate solutions , 2014 .

[10]  J. Nava,et al.  Numerical simulation of the primary, secondary and tertiary current distributions on the cathode of a rotating cylinder electrode cell. Influence of using plates and a concentric cylinder as counter electrodes , 2014 .

[11]  L. Tong,et al.  Simulation study of tertiary current distributions on rotating electrodes , 2012 .

[12]  Frank C. Walsh,et al.  Numerical simulation of the current, potential and concentration distributions along the cathode of a rotating cylinder Hull cell , 2007 .

[13]  M. Pavlović,et al.  Morphologies of copper deposits obtained by the electrodeposition at high overpotentials , 2006 .

[14]  M. Matlosz,et al.  Experimental investigation of the primary and secondary current distribution in a rotating cylinder Hull cell , 1992 .

[15]  M. Eisenberg,et al.  Ionic Mass Transfer and Concentration Polarization at Rotating Electrodes , 1953 .

[16]  W. Barclay.  Principles of electroplating and electroforming (Electrotyping). By W. Blum and G. B. Hogaboom. Pp. xii+356. London: McGraw-Hill Publishing Co., Ltd., 1924. Price 20s , 1924 .

[17]  J. McGeough.  Electroforming , 2019, CIRP Encyclopedia of Production Engineering.

[18]  J. Hihn,et al.  Effect of ultrasound on silver electrodeposition: Crystalline structure modification. , 2018, Ultrasonics sonochemistry.

[19]  J. Nava,et al.  Simulations of Turbulent Flow, Mass Transport, and Tertiary Current Distribution on the Cathode of a Rotating Cylinder Electrode Reactor in Continuous Operation Mode during Silver Deposition , 2017 .

[20]  V. Radojević,et al.  Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films , 2017 .

[21]  Alex D. G. Murrell.  A Study of Testing Different Mandrels for Electroforming Nickel , 2017 .

[22]  R. Sivakumaran,et al.  Modelling the Electroplating of Hexavalent Chromium , 2013 .

[23]  P. T. Gilbert.  4.2 – Copper and Copper Alloys , 1976 .