Chemical interaction, adhesion and diffusion properties at the interface of Cu and plasma-treated thiophene-based plasma polymer (ThioPP) films
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[1] N. Lee,et al. The interface formation and adhesion of metals (Cu, Ta, and Ti) and low dielectric constant polymer-like organic thin films deposited by plasma-enhanced chemical vapor deposition using para-xylene precursor , 2000 .
[2] Wei Shen,et al. Contact angle measurement and surface energetics of sized and unsized paper , 2000 .
[3] T. Tatsumi,et al. Plasma deposition of low-dielectric-constant fluorinated amorphous carbon , 1999 .
[4] A. Benninghoven,et al. Combined ToF-SIMS/XPS study of plasma modification and metallization of polyimide , 1999 .
[5] J. Joo,et al. Polymer-like Organic Thin Films Deposited by Plasma Enhanced Chemical Vapor Deposition Using the Para-xylene Precursor as Low Dielectric Constant Interlayer Dielectrics for Multilevel Metallization , 1999 .
[6] V. M. Donnelly,et al. The interface formation of copper and low dielectric constant fluoro-polymer: Plasma surface modification and its effect on copper diffusion , 1999 .
[7] C. Yue,et al. Kinetics of copper drift in PECVD dielectrics , 1996, IEEE Electron Device Letters.
[8] Maurice Romand,et al. Metal—organic chemical vapor deposition of copper using hydrated copper formate as a new precursor , 1995 .
[9] Y. P. Lee,et al. Adhesion enhancement of ion beam mixed Cu/Al/polyimide , 1997 .
[10] W. Stickle,et al. Handbook of X-Ray Photoelectron Spectroscopy , 1992 .