Influence of the material composition on the environmental impact of surface-mount device (SMD) transistors

Abstract The aim of this study is to better elucidate the influence of surface-mount device (SMD) transistor material composition on the environmental impact of such transistors. A life cycle assessment (LCA) has been performed in which the EcoInvent dataset was updated with material compositions provided by several manufacturers. The influence of the material composition has been studied, providing a more precise understanding of the environmental impact. The software used to develop the LCA model was SimaPro 8.0.3.14, developed by Pre Consultants. The LCA was calculated with the CML methodology. In addition, a life cycle inventory was developed using EcoInvent v3. The EcoInvent methodology was used as a comparison tool for information provided by the manufacturers in terms of environmental impact, thus improving transistor selection in electronics design. The environmental impact of an SMD transistor can vary substantially with respect to material composition. Raw material acquisition represent between 20.3% and 99.9% of the total impact in most environmental categories. By contrast, the environmental impact of each transistor created due to part production is usually lower. The lowest environmental impact comes from the end of life treatments, values for which are approximately 0.1%. This environmental impact study demonstrates the large influence of transistor material composition for those analyzed herein.

[1]  Frank Teuteberg,et al.  Measuring the environmental impact of IT/IS solutions - A life cycle impact modelling approach , 2014, Environ. Model. Softw..

[2]  D. Dornfeld,et al.  Life-cycle energy demand and global warming potential of computational logic. , 2009, Environmental science & technology.

[3]  Taeko Aoe,et al.  Eco-efficiency and ecodesign in electrical and electronic products , 2007 .

[4]  Johan Liu,et al.  ACA bonding technology for low cost electronics packaging applications – current status and remaining challenges , 2001 .

[5]  Pascal Lesage,et al.  Empirically based uncertainty factors for the pedigree matrix in ecoinvent , 2016, The International Journal of Life Cycle Assessment.

[6]  Sarah Boyd,et al.  Life-Cycle Assessment of NAND Flash Memory , 2010, IEEE Transactions on Semiconductor Manufacturing.

[7]  Joeri Van Mierlo,et al.  Environmental impacts of hybrid, plug-in hybrid, and battery electric vehicles—what can we learn from life cycle assessment? , 2014, The International Journal of Life Cycle Assessment.

[8]  Anders S. G. Andrae,et al.  To Which Degree Does Sector Specific Standardization Make Life Cycle Assessments Comparable?—The Case of Global Warming Potential of Smartphones , 2014 .

[9]  Gang Zou,et al.  LCA of electronic products , 2004 .

[10]  Biplab Sikdar,et al.  A study of the environmental impact of wired and wireless local area network access , 2013, IEEE Transactions on Consumer Electronics.

[11]  Anders S. G. Andrae,et al.  LIFE CYCLE ASSESSMENT OF A TELECOMMUNICATIONS EXCHANGE , 2000 .

[12]  Cecilia Håkansson,et al.  Including second order effects in environmental assessments of ICT , 2014, Environ. Model. Softw..

[13]  Roland Hischier,et al.  Life cycle assessment study of a field emission display television device , 2014, The International Journal of Life Cycle Assessment.

[14]  Biplab Sikdar.  Environmental impact of IEEE 802.11 access points: a case study , 2011, PERV.

[15]  Stephen P. Boyd,et al.  Green Manufacturing and Sustainable Manufacturing Partnership Title Life-cycle assessment of computational logic produced from 1995 through 2010 , 2010 .

[16]  Wilson Kindlein,et al.  Methodology of ecodesign for the development of more sustainable electro-electronic equipments , 2008 .

[17]  Michael J Cullen,et al.  Comparative assessment of life cycle assessment methods used for personal computers. , 2010, Environmental science & technology.

[18]  Anders S. G. Andrae,et al.  On thin-clients and the cloud; can smartphones and tablets really reduce electricity consumption? , 2014, 2014 IEEE International Conference on Consumer Electronics (ICCE).

[19]  Albert Malvino,et al.  Electronic Principles , 1979 .

[20]  A. Andrae,et al.  Life cycle assessment of integrated circuit packaging technologies , 2011 .

[21]  Tom Van Gerven,et al.  Recycling of rare earths: a critical review , 2013 .

[22]  Philip Nuss,et al.  Employing Considerations of Criticality in Product Design , 2014 .

[23]  Jens Malmodin,et al.  Simplifying a life cycle assessment of a mobile phone , 2014, The International Journal of Life Cycle Assessment.

[24]  Pascal Lesage,et al.  The application of the pedigree approach to the distributions foreseen in ecoinvent v3 , 2016, The International Journal of Life Cycle Assessment.

[25]  Göran Finnveden,et al.  Lessons learned - Review of LCAs for ICT products and services , 2014, Comput. Ind..

[26]  F.O. Ongondo,et al.  How are WEEE doing? A global review of the management of electrical and electronic wastes. , 2011, Waste management.

[27]  Miriam Borchardt,et al.  Redesign of a component based on ecodesign practices: environmental impact and cost reduction achievements , 2011 .

[28]  Amip J. Shah,et al.  The life cycle assessment of a UK data centre , 2015, The International Journal of Life Cycle Assessment.

[29]  Mario Schmidt,et al.  Life cycle assessment of silicon wafer processing for microelectronic chips and solar cells , 2012, The International Journal of Life Cycle Assessment.

[30]  Marie-France Vernier,et al.  Economic benefits tied to ecodesign , 2011 .

[31]  Gustavo Lannelongue,et al.  Evolution of the electronic waste management system in Spain , 2012 .

[32]  M. Abtew,et al.  Lead-free Solders in Microelectronics , 2000 .

[33]  Dalbir Koshal.  Manufacturing Engineer's Reference Book , 1993 .

[34]  Otto Andersen,et al.  Life cycle assessments of consumer electronics — are they consistent? , 2010 .

[35]  John H. Lau,et al.  Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration , 2014 .

[36]  Anders S. G. Andrae,et al.  Method based on market changes for improvement of comparative attributional life cycle assessments , 2015, The International Journal of Life Cycle Assessment.

[37]  A. S. G. Andrae,et al.  The Effect of Revised Characterization Indices for N 2 Oa nd CO 2 in Life Cycle Assessment of Optical Fiber Networks - The Case of Ozone Depletion and Aquatic Acidification , 2012 .

[38]  Carlos Javierre,et al.  Life cycle assessment of a domestic induction hob: electronic boards , 2014 .

[39]  F. Taiariol,et al.  Life cycle assessment of an integrated circuit product , 2001, Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190).