Numerical study of ductile failure morphology in solder joints under fast loading conditions

Abstract A numerical study is undertaken to investigate solder joint failure under fast loading conditions. The finite element model assumes a lap-shear testing configuration, where the solder joint is bonded to two copper substrates. A progressive ductile damage model is incorporated into the rate-dependent elastic-viscoplastic response of the tin (Sn)–silver (Ag)–copper (Cu) solder alloy, resulting in the capability of simulating damage evolution leading to eventual failure through crack formation. Attention is devoted to deformation under relative high strain rates (1–100 s−1), mimicking those frequently encountered in drop and impact loading of the solder points. The effects of applied strain rate and loading mode on the overall ductility and failure pattern are specifically investigated. It is found that, under shear loading, the solder joint can actually become more ductile as the applied strain rate increases, which is due to the alteration of the crack path. Failure of the solder is very sensitive to the deformation mode, with a superimposed tension or compression on shear easily changing the crack path and tending to reduce the solder joint ductility.

[1]  J. Suhling,et al.  A review of mechanical properties of lead-free solders for electronic packaging , 2009, Journal of Materials Science.

[2]  Nikhilesh Chawla,et al.  Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder , 2003 .

[3]  Willem D. van Driel,et al.  Advances in the drop-impact reliability of solder joints for mobile applications , 2009, Microelectron. Reliab..

[4]  L.J. Ladani,et al.  Effect of Selected Process Parameters on Durability and Defects in Surface-Mount Assemblies for Portable Electronics , 2008, IEEE Transactions on Electronics Packaging Manufacturing.

[5]  K. Suganuma.  Advances in lead-free electronics soldering , 2001 .

[6]  A. Dasgupta,et al.  Failure Site Transition During Drop Testing of Printed Wiring Assemblies , 2005 .

[7]  Kuo-Ning Chiang,et al.  Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact , 2008, Microelectron. Reliab..

[8]  King-Ning Tu,et al.  Physics and materials challenges for lead-free solders , 2003 .

[9]  D. R. Frear,et al.  Parameters affecting thermal fatigue behavior of 60Sn-40Pb solder joints , 1989 .

[10]  Fu Guo,et al.  Residual-mechanical behavior of thermomechanically fatigued Sn-Ag based solder joints , 2002 .

[11]  Fang Liu,et al.  Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact , 2009, Microelectron. Reliab..

[12]  Sang-Su Ha,et al.  Mechanical reliability evaluation of Sn-37Pb solder joint using high speed lap-shear test , 2008 .

[13]  K. N. Subramanian,et al.  Physical metallurgy in lead-free electronic solder development , 2003 .

[14]  A. Hillerborg,et al.  Analysis of crack formation and crack growth in concrete by means of fracture mechanics and finite elements , 1976 .

[15]  M. Abtew,et al.  Lead-free Solders in Microelectronics , 2000 .

[16]  Yu-Lin Shen,et al.  Externally constrained plastic flow in miniaturized metallic structures: A continuum-based approach to thin films, lines, and joints , 2008 .

[17]  Y.-L. Shen,et al.  On the failure path in shear-tested solder joints , 2007, Microelectron. Reliab..

[18]  D. B. Knorr,et al.  The effect of aging on microstructure, room temperature deformation, and fracture of Sn-Bi/Cu solder joints , 1994 .

[19]  P. Lall,et al.  Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging , 2008, IEEE Transactions on Components and Packaging Technologies.

[20]  Nikhilesh Chawla,et al.  Deformation analysis of lap-shear testing of solder joints , 2005 .

[21]  Z. P. Wang,et al.  Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging , 2001 .

[22]  Y. C. Chan,et al.  Residual shear strength of Sn-Ag and Sn-Bi lead-free SMT joints after thermal shock , 2000 .

[23]  Yi-Shao Lai,et al.  Correlation between package-level ball impact test and board-level drop test , 2005, 2005 7th Electronic Packaging Technology Conference.

[24]  W. Tomlinson,et al.  Strength of tin-based soldered joints , 1992 .

[25]  D. R. Frear,et al.  The mechanical behavior of interconnect materials for electronic packaging , 1996 .

[26]  P. Lall,et al.  Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging , 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

[27]  C. Wright,et al.  The Effect of Solid-State Reactions Upon Solder Lap Shear Strength , 1977 .

[28]  Jong-Kai Lin,et al.  Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Sn–3.8Ag–0.7Cu and Eutectic SnPb Solders , 2007, IEEE Transactions on Electronics Packaging Manufacturing.

[29]  A. Syed,et al.  Plastic Deformation and Life Prediction of Solder Joints for Mechanical Shock and Drop/Impact Loading Conditions , 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

[30]  Yu-Lin Shen,et al.  Effects of Grain Boundary Sliding on Microstructural Evolution and Damage Accumulation in Tin-Lead Alloy , 2004 .

[31]  Guna S Selvaduray,et al.  Solder joint fatigue models: review and applicability to chip scale packages , 2000 .

[32]  P. Lall,et al.  Solder Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite-Element Submodeling , 2006, IEEE Transactions on Electronics Packaging Manufacturing.

[33]  Yi-Shao Lai,et al.  Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling , 2008 .

[34]  T. Mattila,et al.  Reliability of lead-free interconnections under consecutive thermal and mechanical loadings , 2006 .

[35]  O. Ruano,et al.  Microstructure and high temperature mechanical properties of tin , 1995 .

[36]  W. J. Plumbridge,et al.  Solders in electronics , 1996, Journal of Materials Science.

[37]  Nikhilesh Chawla,et al.  An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation , 2004 .