A simple 1-D finite elements approach to model the effect of PCB in electronic assemblies

Abstract In this paper, a simple method to describe the effect of Printed Circuit Board (PCB) and environment on the thermal behavior of packaged devices is addressed. This approach aims at exploiting the benefit of compact thermal models, which are necessarily one-dimensional, together with the advantage of Finite Element (FE) modeling, which retains all the three-dimensional geometrical details, only in the regions of the model that must be accurately described. The main focus is on correct modeling of long power pulses for subsequent electro-thermal and thermo-mechanical analysis at chip level.

[1]  Nicola Delmonte,et al.  Large-signal GaN HEMT electro-thermal model with 3D dynamic description of self-heating , 2011, 2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC).

[2]  M. Nelhiebel,et al.  Non-conforming meshes in multi-scale thermo-mechanical Finite Element Analysis of semiconductor power devices , 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

[3]  G. Wachutka,et al.  Combination of thermal subsystems modeled by rapid circuit transformation , 2007, 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC).

[4]  J. D. Parry,et al.  The world of thermal characterization according to DELPHI-Part I: Background to DELPHI , 1997 .

[5]  M. Nelhiebel,et al.  Multiscale FE modeling concepts applied to microelectronic device simulations , 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

[6]  Nicola Delmonte,et al.  Heat management for power converters in sealed enclosures: A numerical study , 2009, Microelectron. Reliab..

[7]  Andrea Irace,et al.  FEM simulation approach to investigate electro-thermal behavior of power transistors in 3-D , 2013, Microelectron. Reliab..

[8]  J. D. Parry,et al.  The world of thermal characterization according to DELPHI-Part II: Experimental and numerical methods , 1997 .