Acoustic noise and vibration analysis of solid state drive induced by multi-layer ceramic capacitors
暂无分享,去创建一个
[1] Miroslav Pástor,et al. Modal Assurance Criterion , 2012 .
[2] Daniel Kraetschmer,et al. Efficient modeling of printed circuit boards structures for dynamic simulations , 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
[3] 이주엽,et al. SSD 강제진동 시 더미 솔더 볼 효과에 의한 피로수명 예측 , 2015 .
[4] No-Cheol Park,et al. Analysis of the correlation between acoustic noise and vibration generated by a multi-layer ceramic capacitor , 2014 .
[5] Fook Fah Yap,et al. Vibration reliability characterization of PBGA assemblies , 2000 .
[6] S. Tsai,et al. Introduction to composite materials , 1980 .
[7] Jae Kwak,et al. Transient Dynamic Simulation and Full-Field Test Validation for A Slim-PCB Of Mobile Phone under Drop / Impact , 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.
[8] K. H. Low,et al. Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards , 2006, Microelectron. Reliab..
[9] M. Auer,et al. Ersatz für Verschmutzungen durch schadhaftes Bitumen , 2009 .
[10] Shaker A. Meguid,et al. Efficient multi-level modeling technique for determining effective board drop reliability of PCB assembly , 2013, Microelectron. Reliab..
[11] S. Rzepka,et al. A multilayer PCB material modeling approach based on laminate theory , 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
[12] No-Cheol Park,et al. Study on effective piezoelectric coefficient for finite element analysis of multi-layer ceramic capacitor , 2015, 2015 Joint IEEE International Symposium on the Applications of Ferroelectric (ISAF), International Symposium on Integrated Functionalities (ISIF), and Piezoelectric Force Microscopy Workshop (PFM).
[13] Young Pil Park,et al. Identification of the electromechanical material properties of a multilayer ceramic capacitor , 2017 .
[14] John H. L. Pang,et al. Vibration reliability test and finite element analysis for flip chip solder joints , 2009, Microelectron. Reliab..
[15] No-Cheol Park,et al. Analysis of high-pitched noise from solid-state drives generated by multilayer ceramic capacitors , 2016 .