A Novel Fan-Out Concept for Ultra-High Chip-to-Chip Interconnect Density with 20-µm Pitch
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Eric Beyne | Andy Miller | John Slabbekoorn | Mario Gonzalez | Gerald Beyer | Arnita Podpod | Alain Phommahaxay | Abdellah Salahouelhadj | K. Rebibis | Andy Miller | G. Beyer | E. Beyne | J. Slabbekoorn | A. Phommahaxay | Mario Gonzalez | F. Duval | A. Salahouelhadj | A. Podpod | Fabrice Duval | Kenneth Rebibis
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