The radiant heat circuit board, the manufacturing method thereof and the heat generating device package having the same

PURPOSE: A heat dissipation circuit board and a manufacturing method thereof and a heat generation element package including the same are provided to improve heat emission efficiency by directly transferring heat discharged from a heat generation element to a metal palate. CONSTITUTION: A metal plate(110) comprises a metallic projection. A plurality of insulating layers is formed on the metal plate while exposing the metallic projection. The metallic projection constitutes a mounting pad(115a) mounting a heat generation element(200). The metallic projection is extended from the metal plate and is perpendicularly projected. A solder is located on the upper side of the metallic projection. A second circuit pattern comprises a plurality of power pads(156a-156d), a plurality of electrode pads(153, 155), and a plurality of circuit wires.