论文信息 - RESIDUAL FATIGUES IN MICROELECTRONIC DEVICES DUE TO THERMOELASTIC STRAINS CAUSED BY REPETITIVE ELECTRICAL OVERSTRESSINGS: A MODEL FOR LATENT FAILURES. - 字舞流文

RESIDUAL FATIGUES IN MICROELECTRONIC DEVICES DUE TO THERMOELASTIC STRAINS CAUSED BY REPETITIVE ELECTRICAL OVERSTRESSINGS: A MODEL FOR LATENT FAILURES.

Tapan K. Sarkar | Perambur S. Neelakantaswamy | Ibrahim R. Turkman | T. Sarkar | P. Neelakantaswamy | I. Turkman