Reliability of POL-kw power modules

Wide band gap (WBG) semiconductor devices have demonstrated superior electrical and thermal performance, compared to their silicon-based counterparts. However, innovative power module packaging design and materials suitable to WBG devices are required. In this paper, the development of a new high power density module using the Power Overlay (POL) packaging platform is presented. The wirebond-less packaging platform has shown significantly reduced electrical parasitics, while providing a thin profile to allow double-side cooling and the integration of gate drive circuits. Thermal cycling and high temperature storage tests were conducted on specimens fabricated and assembled by production equipment. The results presented here were used to establish design guidelines for reliable operation of POL-based power modules.