Power efficient design of an amplifier using submicron technology

In an electronics circuit, a set of components named as modules or blocks are connected through ‘wires’ called as interconnects. Floorplanning and placement are used to reduce the total area, size, power, temperature and cost of any circuit design. Various computational techniques are used to calculate and minimise the above parameters. A single IC consists of number of processing elements (PEs), which works on various voltage ranges. This makes IC power consumption increase; thereby temperature of the chip also increases. The increased temperature positions in some parts are called as hot-spots. The main goal of this paper is to focus on calculation of area, power and hotspot of any complicated VLSI circuit and to show microwind simulation output for future design of any complicated circuits for various temperature ranges. The deep submicron technology is widely used for design of any analogue circuits in microwind.