Boundary condition independent compact models of dynamic thermal networks with many heat sources

A novel approach, based both on multivariate moment matching and singular value decomposition, is proposed for generating passive compact models of boundary condition independent dynamic thermal networks with many heat sources. As main result, the generated passive compact dynamic thermal networks both assure a prescribed accuracy and have a number of elements linearly related to the number of heat sources

[1]  Paolo Maffezzoni,et al.  Compact modeling of electrical devices for electrothermal analysis , 2003 .

[2]  P. Maffezzoni,et al.  Multivariate moment matching for generating boundary condition independent compact dynamic thermal networks of packages [BGA example] , 2005, Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005..

[3]  Paolo Maffezzoni,et al.  A novel approach for generating dynamic compact models of thermal networks having large numbers of power sources , 2005 .

[4]  L. Codecasa,et al.  A novel approach for generating boundary condition independent compact dynamic thermal networks of packages , 2005, IEEE Transactions on Components and Packaging Technologies.

[5]  H. Vinke,et al.  A novel approach for the thermal characterization of electronic parts , 1995, Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[6]  Gene H. Golub,et al.  Matrix computations , 1983 .

[7]  L. Greengard The Rapid Evaluation of Potential Fields in Particle Systems , 1988 .

[8]  M.-N. Sabry High-precision compact-thermal models , 2005, IEEE Transactions on Components and Packaging Technologies.