Thermal Models for Optical Circuit Simulation Using a Finite Cloud Method and Model Reduction Techniques

This paper presents a procedure for the creation of versatile and powerful thermal compact models of integrated optical devices and demonstrates their use in an optical circuit level simulator. A detailed 3-D model of the device is first built using a meshless finite cloud method, producing a large linear sparse set of equations. This model is then reduced to a compact representation using a Krylov subspace model reduction (MR) technique. Such a reduced model is described by small dense matrices, but can reproduce the original temperature distribution within acceptable error. Three devices are used as demonstration models for the technique: a microdisc laser and two microring-based devices, a modulator, and an optical switch. All three devices are built in a silicon on oxide platform. Using MR the linear systems describing these models are reduced from thousands of unknowns to systems with less than 100 reduced variables. It is then demonstrated how the reduced compact models can be linked together to describe a complete optical system with solution errors of lower than 1%. Finally, it is shown how this reduced thermal model can be utilized in a circuit level opto-electronic circuit simulator and simulations are presented, demonstrating the effectiveness of the reduced models in speeding up simulation times or enabling otherwise intractable problems.

[1]  P. Dapkus,et al.  Microdisk lasers vertically coupled to output waveguides , 2002, IEEE Photonics Technology Letters.

[2]  Ashok V. Krishnamoorthy,et al.  High-efficiency 25Gb/s CMOS ring modulator with integrated thermal tuning , 2011, 8th IEEE International Conference on Group IV Photonics.

[3]  Luca P. Carloni,et al.  Physical-Layer Modeling and System-Level Design of Chip-Scale Photonic Interconnection Networks , 2011, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

[4]  M.-N. Sabry,et al.  Dynamic Compact Thermal Models Used for Electronic Design: A Review of Recent Progress , 2003 .

[5]  Michel Nakhla,et al.  Multi-dimensional model reduction of VLSI interconnects , 2000, Proceedings of the IEEE 2000 Custom Integrated Circuits Conference (Cat. No.00CH37044).

[6]  P Gunupudi,et al.  Self-Consistent Simulation of Opto-Electronic Circuits Using a Modified Nodal Analysis Formulation , 2010, IEEE Transactions on Advanced Packaging.

[7]  M.S. Nakhla,et al.  Hierarchical thermal analysis of large IC modules , 2005, IEEE Transactions on Components and Packaging Technologies.

[8]  David Z. Pan,et al.  OIL: a nano-photonics optical interconnect library for a new photonic networks-on-chip architecture , 2009, SLIP '09.

[9]  James Demmel,et al.  Applied Numerical Linear Algebra , 1997 .

[11]  Tom J. Smy,et al.  Simulation of inhomogeneous models using the finite cloud method. Simulation inhomogener Modelle unter Benutzung der Finite‐Wolken‐Methode , 2010 .

[12]  Lawrence T. Pileggi,et al.  PRIMA: passive reduced-order interconnect macromodeling algorithm , 1998, 1997 Proceedings of IEEE International Conference on Computer Aided Design (ICCAD).

[13]  R. Soref,et al.  The Past, Present, and Future of Silicon Photonics , 2006, IEEE Journal of Selected Topics in Quantum Electronics.

[14]  Richard A. Soref,et al.  Silicon-based optoelectronics , 1993, Proc. IEEE.

[15]  Qianfan Xu,et al.  Micrometre-scale silicon electro-optic modulator , 2005, Nature.

[16]  N. Aluru,et al.  Finite cloud method: a true meshless technique based on a fixed reproducing kernel approximation , 2001 .

[17]  Winnie N. Ye,et al.  Circuit-level transient simulation of configurable ring resonators using physical models , 2011 .

[18]  Roel Baets,et al.  Building technology platforms and foundries for photonic integrated circuits in Europe , 2008, SPIE Photonics Europe.

[19]  T. Smy,et al.  Algorithmic Approach for Thermal Port Definition , 2007, IEEE Transactions on Advanced Packaging.

[20]  J. D. Parry,et al.  The world of thermal characterization according to DELPHI-Part I: Background to DELPHI , 1997 .

[21]  R. Khazaka,et al.  Fast Simulation of steady-state temperature distributions in electronic components using multidimensional model reduction , 2005, IEEE Transactions on Components and Packaging Technologies.

[22]  Xuezhe Zheng,et al.  Highly-efficient thermally-tuned resonant optical filters. , 2010, Optics express.

[23]  Tom J. Smy,et al.  A 3D thermal simulation tool for integrated devices-Atar , 2001, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..