论文信息 - On-chip UWB phased arrays for mmW connectivity

On-chip UWB phased arrays for mmW connectivity

We present a multilayer mmW phased array topology that can be lithographically fabricated above transceiver substrates. The ultra-wideband array exhibits continuous impedance bandwidth of 35-70GHz and is isolated from the lossy substrate with a ground plane. As such, the total efficiency of the array is over 60% over the entire impedance bandwidth. Perhaps more importantly, the overall height of the structure is less than 500μm, having a footprint of 7mm×3mm on the wafer, making it ideal for conformal and mobile applications for next-generation wireless systems.

Kubilay Sertel | Seckin Sahin | Niru K. Nahar

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