Sub-THz interconnect for planar chip-to-chip communications

This paper presents both microstrip line based and dielectric waveguide based sub-THz interconnect for high energy efficiency and high bandwidth density chip-to-chip communications. The data rates of microstrip line based interconnect with 0.06-dB/mm channel loss and dielectric waveguide based interconnect with 0.04-dB/mm channel loss are up to 12.2 Gb/s and 12.1 Gb/s, respectively. The highest energy efficiency and bandwidth density achieved are up to 0.32 pJ/b and 100 Gb/s/mm2.

[1]  Qun Jane Gu,et al.  High-Efficiency Micromachined Sub-THz Channels for Low-Cost Interconnect for Planar Integrated Circuits , 2016, IEEE Transactions on Microwave Theory and Techniques.

[2]  Q. Gu,et al.  A 165-GHz Transmitter With 10.6% Peak DC-to-RF Efficiency and 0.68-pJ/b Energy Efficiency in 65-nm Bulk CMOS , 2016, IEEE Transactions on Microwave Theory and Techniques.

[4]  Kosuke Katayama,et al.  98 mW 10 Gbps Wireless Transceiver Chipset With D-Band CMOS Circuits , 2013, IEEE Journal of Solid-State Circuits.

[5]  Qun Jane Gu,et al.  High energy-efficiency high bandwidth-density sub-THz interconnect for the “Last-Centimeter” chip-to-chip communications , 2017, 2017 IEEE MTT-S International Microwave Symposium (IMS).

[6]  Tanaka Shinsuke,et al.  A 25Gb/s Hybrid Integrated Silicon Photonic Transceiver in 28nm CMOS and SOI , 2015 .

[7]  Kenichi Okada,et al.  13.3 A 56Gb/s W-band CMOS wireless transceiver , 2016, 2016 IEEE International Solid-State Circuits Conference (ISSCC).

[8]  Keiichi Higeta,et al.  3.3 A 25Gb/s multistandard serial link transceiver for 50dB-loss copper cable in 28nm CMOS , 2016, 2016 IEEE International Solid-State Circuits Conference (ISSCC).

[9]  Samuel Jameson,et al.  A packaged 106–110 GHz bi-directional 10Gbps 0.11 pJ/bit/cm CMOS transceiver , 2015, 2015 IEEE MTT-S International Microwave Symposium.

[10]  Yoichi Koyanagi,et al.  22.2 A 25Gb/s hybrid integrated silicon photonic transceiver in 28nm CMOS and SOI , 2015, 2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers.

[11]  Qun Jane Gu,et al.  Low-loss and Broadband G-Band Dielectric Interconnect for Chip-to-Chip Communication , 2016, IEEE Microwave and Wireless Components Letters.