Spatial distribution of trapped holes in SiO2
暂无分享,去创建一个
Kenji Taniguchi | Chihiro Hamaguchi | Naoki Yasuda | K. Taniguchi | N. Yasuda | C. Hamaguchi | Q. Khosru | Quazi D. M. Khosru
[1] Bruce E. Deal,et al. Interface states and electron spin resonance centers in thermally oxidized (111) and (100) silicon wafers , 1981 .
[2] Scott E. Thompson,et al. A new measurement method for trap properties in insulators and semiconductors: Using electric field stimulated trap‐to‐band tunneling transitions in SiO2 , 1991 .
[3] J. F. Verwey,et al. Nonavalanche injection of hot carriers into SiO2 , 1973 .
[4] E. Takeda,et al. An empirical model for device degradation due to hot-carrier injection , 1983, IEEE Electron Device Letters.
[5] B. S. Doyle,et al. Examination of gradual-junction p-MOS structures for hot carrier control using a new lifetime extraction method , 1992 .
[6] Kenji Taniguchi,et al. Oxide thickness dependence of interface trap generation in a metal‐oxide‐semiconductor structure during substrate hot‐hole injection , 1993 .
[7] Y. Ohji,et al. Hot-electron hardened Si-gate MOSFET utilizing F implantation , 1989, IEEE Electron Device Letters.
[8] A. Reisman,et al. Hole trapping phenomena in the gate insulator of As‐fabricated insulated gate field effect transistors , 1990 .
[9] Geert Van den bosch,et al. Critical analysis of the substrate hot-hole injection technique , 1994 .
[10] James Stasiak,et al. Trap creation in silicon dioxide produced by hot electrons , 1989 .
[11] T. A. DeMassa,et al. Drain-engineered hot-electron-resistant device structures: a review , 1989 .
[12] R. F. De Keersmaecker,et al. Oxide field dependence of SiSiO2 interface state generation and charge trapping during electron injection , 1989 .
[13] Douglas A. Buchanan,et al. Interface and bulk trap generation in metal‐oxide‐semiconductor capacitors , 1990 .
[14] J. Marsland. Power series approximation used in soft threshold lucky drift model of impact ionisation , 1990 .
[15] D. Dimaria,et al. Correlation of trap creation with electron heating in silicon dioxide , 1987 .
[16] S. Lyon. Interface states generated by the injection of electrons and holes into SiO2 , 1989 .
[17] K. Brennan,et al. Electron and hole impact ionization coefficients in (100) and in (111) Si , 1985 .
[18] N. Sano,et al. Monte Carlo analysis of ionization threshold in Si , 1990 .
[19] D. R. Young,et al. Avalanche Injection of Holes into SiO2 , 1977, IEEE Transactions on Nuclear Science.
[20] R.H. Dennard,et al. 1 µm MOSFET VLSI technology: Part IV—Hot-electron design constraints , 1979, IEEE Transactions on Electron Devices.
[21] J. Maldonado,et al. Generation and annealing of defects in silicon dioxide , 1987 .
[23] G. Groeseneken,et al. Consistent model for the hot-carrier degradation in n-channel and p-channel MOSFETs , 1988 .
[24] S. Lai,et al. Interface trap generation in silicon dioxide when electrons are captured by trapped holes , 1983 .
[25] T. Ning. Capture cross section and trap concentration of holes in silicon dioxide , 1976 .
[26] W. K. Schubert,et al. Hole trapping in oxides grown by rapid thermal processing , 1988 .
[27] Arnold Reisman,et al. The distribution of radiation‐induced charged defects and neutral electron traps in SiO2, and the threshold voltage shift dependence on oxide thickness , 1990 .
[28] S. M. Sze,et al. Physics of semiconductor devices , 1969 .
[29] P. Balk,et al. DEFECT STRUCTURE AND GENERATION OF INTERFACE STATES IN MOS STRUCTURES , 1986 .
[30] W. Weber,et al. Investigation on the oxide field dependence of hole trapping and interface state generation in SiO2 layers using homogeneous nonavalanche injection of holes , 1990 .
[31] S. Ogura,et al. Design and characteristics of the lightly doped drain-source (LDD) insulated gate field-effect transistor , 1980 .