Mixed electromagnetic and electrical circuit simulation for RFIC characterization

IC foundries such as UMC have adopted a combined electromagnetic field-electrical circuit simulation approach for modeling on-chip passive interconnect structures. This approach provides an accurate method for characterizing the frequency response of 3D structures such as spiral inductors. Using 3D electromagnetic field simulation provides an accurate characterization of the frequency response of the spiral. The frequency response of the S-parameters is evaluated as a reduced order circuit model that is combined with SPICE files to provide electromagnetically accurate circuit behavior used in chip level simulations.