Development research of thermocouple-based microwave power sensors using AC/DC substitution method
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Yanyan Guo | Changchun Zhang | Jing Chen | De-Bo Wang | Wen-Juan Bai | J. Chen | Debo Wang | Changchun Zhang | Yanyan Guo | Wengang Bai
[1] High-frequency current distribution in thin-film comb thermal converter , 2005 .
[2] De-bo Wang,et al. A terminating-type MEMS microwave power sensor and its amplification system , 2010 .
[3] H. Nilsson,et al. Design of a Micromachined Thermopile Infrared Sensor With a Self-Supported ${\rm SiO}_{2}/{\rm SU}{-}8$ Membrane , 2008, IEEE Sensors Journal.
[4] X. Liao,et al. Optimization of Indirectly-Heated Type Microwave Power Sensors Based on GaAs Micromachining , 2012, IEEE Sensors Journal.
[5] Pascal Xavier,et al. A power sensor for fast measurement of telecommunications signals using substitution method , 2001, IEEE Trans. Instrum. Meas..
[7] X.-P. Liao,et al. Research on sensitivity characteristic of indirectly-heated type thermopile power sensor , 2011 .
[8] Mircea Dragoman,et al. Millimeter-wave passive circuit elements based on GaAs micromachining , 2005 .
[9] D. Pozar. Microwave Engineering , 1990 .
[10] H. Tilmans. Equivalent circuit representation of electromechanical transducers: I. Lumped-parameter systems , 1996 .
[11] Jongseok Kim,et al. RF device package method using Au to Au direct bonding technology , 2009, Microelectron. Reliab..
[12] R. P. Ribas,et al. An approach for microsystems codesign , 1999, Proceedings. XII Symposium on Integrated Circuits and Systems Design (Cat. No.PR00387).
[13] K. Shih,et al. Contact resistances of AuGeNi, AuZn and Al to III–V compounds , 1972 .
[14] L. Grno. Thermal wattmeter with direct power conversion , 1995 .
[15] Yeun-Ho Joung,et al. Chip-to-Board Micromachining for Interconnect Layer Passive Components , 2007, IEEE Transactions on Components and Packaging Technologies.
[16] Jonathan B. Scott,et al. New Thermocouple-Based Microwave/Millimeter-Wave Power Sensor MMIC Techniques in GaAs , 2011, IEEE Transactions on Microwave Theory and Techniques.
[17] De-bo Wang,et al. A voltage source model on thermoelectric power sensor based on MEMS technology , 2011 .
[18] L.P.B. Katehi,et al. Fabrication and accelerated hermeticity testing of an on-wafer package for RF MEMS , 2004, IEEE Transactions on Microwave Theory and Techniques.
[19] De-bo Wang,et al. A novel symmetrical microwave power sensor based on GaAs monolithic microwave integrated circuit technology , 2009 .