Design for failure analysis inserting replacement-type observation points for LVP
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[1] Steven Kasapi,et al. Practical, non-invasive optical probing for flip-chip devices , 2001, Proceedings International Test Conference 2001 (Cat. No.01CH37260).
[2] A. Tosi,et al. Switching Time Extraction of CMOS Gates using Time-Resolved Emission (TRE) , 2006, 2006 IEEE International Reliability Physics Symposium Proceedings.
[3] Irith Pomeranz,et al. Z-DFD: design-for-diagnosability based on the concept of Z-detection , 2004, 2004 International Conferce on Test.
[4] K. Nikawa,et al. New Laser Beam Neating Methods Applicable to Fault Localization and Defect Detection in VLSI Devices , 1996, Proceedings of International Reliability Physics Symposium.
[5] Mario J. Paniccia,et al. Laser voltage probe (LVP): a novel optical probing technology for flip-chip packaged microprocessors , 1999, Proceedings of the 1999 7th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.99TH8394).
[6] G. Woods,et al. Backside infrared probing for static voltage drop and dynamic timing measurements , 2001, 2001 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC (Cat. No.01CH37177).
[7] H. K. Heinrich,et al. Measurement of real-time digital signals in a silicon bipolar junction transistor using a noninvasive optical probe , 1986 .