论文信息 - Thermal impedance spectroscopy of power modules

Thermal impedance spectroscopy of power modules

Abstract In this paper, a method of thermal impedance spectroscopy for power modules is presented. This method enables a high resolution non-destructive analysis of the power module by means of electrical measurement and subsequent mathematical evaluation. The result provides a separation of partial thermal resistances corresponding material layers and facilitates a plausible estimation of geometrical dimensions of the power module package within the heat flow path. This method is applied for localization of failures during power cycling test.

[1] V. Székely,et al. A new evaluation method of thermal transient measurement results , 1997 .

[2] T. J. Kennett,et al. Bayesian deconvolution I: Convergent properties , 1978 .

[3] Marta Rencz,et al. Measuring partial thermal resistances in a heat-flow path , 2002 .

[4] G. Wachutka,et al. Combination of thermal subsystems modeled by rapid circuit transformation , 2007, 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC).