Packaging and Interconnect Techniques for Complex Millimeter-Wave Front-Ends

Millimeter-wave systems increasingly are entering into commercial systems, both for communication and sensors for traffic or industrial applications. In many cases, circuit technology of the involved front-ends includes monolithic and hybrid integrated circuits and even waveguide components like filters or antenna feeds. In addition to the standard technical and environmental requirements, these front-ends have to be fabricated in large quantities at very low cost. After a short review of the problems and some general interconnect and packaging techniques for mm-wave front-ends, achievements of different research programs will be presented with emphasis on the application of multilayer carrier substrates to mm-wave circuits and the realization of packages including waveguide components byplastic injection molding.