Evidence of ultra-low-k dielectric material degradation and nanostructure alteration of the Cu/ultra-low-k interconnects in time-dependent dielectric breakdown failure
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Fan Zhang | Jeffrey Lam | Zexiang Shen | Handong Sun | Tsu Hau Ng | M. K. Dawood | Zhihong Mai | Anyan Du | Handong Sun | A. Du | Zexiang Shen | J. Lam | T. H. Ng | Maggie Yamin Huang | Mohammed Khalid Bin Dawood | Z. Mai | Fan Zhang
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