On the standardization of thermal characterization of LEDs

Nowadays the demand for thermal standards for power LEDs is increasing. On the one hand metrics for fair comparison of competing products are needed; on the other hand, designers of power LED-based applications demand reliable and meaningful data for their daily work. Today's data sheet information does hardly meet any of these requirements. In earlier papers [1] [2] we compared the current situation in the LED world with the situation in the IC world over twenty years ago, observed that much can be learned from the progress achieved, and concluded with a proposal for action. This paper addresses thermal issues that are specific to light emitting diodes (in fact, also semiconductor devices), the drawbacks of the current situation with respect to the information in the data sheets, and emphasizes the need for electro-thermal models. It also includes a new version of the proposal for action. Note: This paper is an update of a paper presented at THERMINIC 2008[3].

[1]  G. Farkas,et al.  Thermal investigation of high power Optical Devices by transient testing , 2005, IEEE Transactions on Components and Packaging Technologies.

[2]  Osamu Ueda,et al.  Reliability issues in III–V compound semiconductor devices: optical devices and GaAs-based HBTs , 1999 .

[3]  Thorvald G. Andersson,et al.  Study of degradation mechanism of blue light emitting diodes , 2005 .

[4]  J.H. Yu,et al.  PC Board Thermal Management of High Power LEDs , 2008, 2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

[5]  Yan Zhang,et al.  Thermal characterization of multi-die packages , 2006, 2006 8th Electronics Packaging Technology Conference.

[6]  A. Poppe,et al.  On the standardisation of thermal characterisation of LEDs Part II: Problem definition and potential solutions , 2008, 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems.

[7]  Lianqiao Yang,et al.  Mechanism and thermal effect of delamination in light-emitting diode packages , 2005, Microelectron. J..

[8]  Hyunsang Hwang,et al.  Electromigration-induced failure of GaN multi-quantum well light emitting diode , 2000 .

[9]  Y.K. Lin,et al.  Failure Mechanisms Associated with Lens Shape of High-Power LED Modules in Aging Test , 2007, LEOS 2007 - IEEE Lasers and Electro-Optics Society Annual Meeting Conference Proceedings.

[10]  T. Treurniet,et al.  Thermal management in color variable multi-chip led modules , 2006, Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium.

[11]  M. Craford,et al.  Status and Future of High-Power Light-Emitting Diodes for Solid-State Lighting , 2007, Journal of Display Technology.

[12]  C.J.M. Lasance On the standardisation of thermal characterisation of LEDs Part I: Comparison with IC packages and proposal for action , 2008, 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems.

[13]  Jean Paul Freyssinier,et al.  Solid-state lighting: failure analysis of white LEDs , 2004 .