Dielectric Barrier Discharge Plasma Deoxidation of Copper Surfaces in an Ar/SiH4 Atmosphere

[1]  S. Dahle,et al.  Reduction of copper surface oxide using a sub-atmospheric dielectric barrier discharge plasma , 2021, Applied Surface Science.

[2]  R. Gustus,et al.  Oxygen-free transport of samples in silane-doped inert gas atmospheres for surface analysis , 2021, Journal of Vacuum Science & Technology B.

[3]  S. Kaierle,et al.  PBF-LB/M process under a silane-doped argon atmosphere: Preliminary studies and development of an innovative machine concept , 2021 .

[4]  A. R. Franco,et al.  Morphological changes and kinetic assessment of Cu2O powder reduction by non-thermal hydrogen plasma , 2021 .

[5]  B. Denkena,et al.  Towards Dry Machining of Titanium-Based Alloys: A New Approach Using an Oxygen-Free Environment , 2020, Metals.

[6]  G. Grundmeier,et al.  Surface modification of ZnMgAl-coated steel by dielectric-barrier discharge plasma , 2019, RSC advances.

[7]  H. Maier,et al.  Brazing in SiH4-Doped Inert Gases: A New Approach to an Environment Friendly Production Process , 2019, International Journal of Precision Engineering and Manufacturing-Green Technology.

[8]  S. V. Hulle,et al.  Investigation of plasma‐induced chemistry in organic solutions for enhanced electrospun PLA nanofibers , 2018 .

[9]  A. Calzolari,et al.  Doping and oxidation effects under ambient conditions in copper surfaces: a “real-life” CuBe surface , 2018 .

[10]  Ashley R. Head,et al.  Water Adsorption and Dissociation on Polycrystalline Copper Oxides: Effects of Environmental Contamination and Experimental Protocol. , 2017, The journal of physical chemistry. B.

[11]  A. Bahari,et al.  Structural and dielectric characteristic of povidone–silica nanocomposite films on the Si (n) substrate , 2017 .

[12]  D. Das,et al.  Nanocrystalline silicon thin films from SiH 4 plasma diluted by H 2 and He in RF-PECVD , 2017 .

[13]  M. Biesinger.  Advanced analysis of copper X‐ray photoelectron spectra , 2017 .

[14]  Françoise Massines,et al.  Atmospheric Pressure Radio‐Frequency DBD Deposition of Dense Silicon Dioxide Thin Film , 2016 .

[15]  J. Lelievre,et al.  Influence of the Discharge Mode on the Optical and Passivation Properties of SiNx:H Deposited by PECVD at Atmospheric Pressure☆ , 2016 .

[16]  B. Weckhuysen,et al.  Extending the plasmonic lifetime of tip-enhanced Raman spectroscopy probes. , 2016, Physical chemistry chemical physics : PCCP.

[17]  H. Bhuyan,et al.  Study on the effect of hydrogen addition on the variation of plasma parameters of argon-oxygen magnetron glow discharge for synthesis of TiO2 films , 2016 .

[18]  A. Michaelides,et al.  Atomistic details of oxide surfaces and surface oxidation: the example of copper and its oxides , 2015, 1508.01005.

[19]  Lei Zhao,et al.  In situ optical emission spectroscopy diagnostics of glow discharges in SiH4/GeH4/H2 , 2015 .

[20]  Minoru Fujii,et al.  An investigation into second harmonic generation by Si-rich SiNx thin films deposited by RF sputtering over a wide range of Si concentrations , 2014 .

[21]  M. Cernak,et al.  Generation of Large‐Area Highly‐Nonequlibrium Plasma in Pure Hydrogen at Atmospheric Pressure , 2014 .

[22]  Z. Xiuling,et al.  Preparation of Copper Nanoparticles Using Dielectric Barrier Discharge at Atmospheric Pressure and its Mechanism , 2014 .

[23]  J. Kováč,et al.  XPS and AFM characterization of aminosilanes with different numbers of bonding sites on a silicon wafer , 2013 .

[24]  S. Dahle,et al.  Silicon Dioxide Coating of Titanium Dioxide Nanoparticles from Dielectric Barrier Discharge in a Gaseous Mixture of Silane and Nitrogen , 2013, Plasma Chemistry and Plasma Processing.

[25]  Bin Qi,et al.  On the Mechanism of Copper Oxide Reduction by Dielectric Barrier Discharge Plasma Using H2 and Ar Mixture Gases , 2013 .

[26]  S. Lynch.  Hydrogen embrittlement phenomena and mechanisms , 2012 .

[27]  F. Endres,et al.  Plasma-oxidation of Ge(100) surfaces using dielectric barrier discharge investigated by metastable induced electron spectroscopy, ultraviolet photoelectron spectroscopy, and x-ray photoelectron spectroscopy , 2011 .

[28]  R. Calland,et al.  Argon purification studies and a novel liquid argon re-circulation system , 2011, 1106.5226.

[29]  A. Yabuki,et al.  Electrical conductivity of copper nanoparticle thin films annealed at low temperature , 2010 .

[30]  Christophe Leys,et al.  Atmospheric pressure plasma jet in Ar and Ar/H2O mixtures: Optical emission spectroscopy and temperature measurements , 2010 .

[31]  H. Haick,et al.  Formation of ultrasmooth and highly stable copper surfaces through annealing and self-assembly of organic monolayers. , 2010, Langmuir : the ACS journal of surfaces and colloids.

[32]  E. Filatova,et al.  Interface analysis of HfO2 films on (1 0 0)Si using x-ray photoelectron spectroscopy , 2009 .

[33]  Jhuma Gope,et al.  High-pressure condition of SiH4+Ar+H2 plasma for deposition of hydrogenated nanocrystalline silicon film , 2008 .

[34]  Ilia Platzman,et al.  Oxidation of Polycrystalline Copper Thin Films at Ambient Conditions , 2008 .

[35]  B. Rech,et al.  Hidden parameters in the plasma deposition of microcrystalline silicon solar cells , 2007 .

[36]  F. Massines,et al.  Nano-particle size-dependent charging and electro-deposition in dielectric barrier discharges at atmospheric pressure for thin SiOx film deposition , 2007 .

[37]  Han Gao-rong,et al.  Room Temperature Growth of Hydrogenated Amorphous Silicon Films by Dielectric Barrier Discharge Enhanced CVD , 2007 .

[38]  J. White,et al.  Copper oxide reduction through vacuum annealing , 2003 .

[39]  L. Feitknecht,et al.  Plasma deposition of thin film silicon: kinetics monitored by optical emission spectroscopy , 2002 .

[40]  Hei Wong,et al.  Short-range order in non-stoichiometric amorphous silicon oxynitride and silicon-rich nitride , 2002 .

[41]  Ba Bas Korevaar,et al.  Hydrogenated amorphous silicon deposited at very high growth rates by an expanding Ar-H2-SiH4 plasma , 2001 .

[42]  J. Bastidas,et al.  X-Ray Photoelectron Spectroscopy Study on the Chemical Composition of Copper Tarnish Products Formed at Low Humidities , 2001 .

[43]  Rolf Kieselbach,et al.  Damage due to hydrogen embrittlement and stress corrosion cracking , 2000 .

[44]  K. Tachibana,et al.  Reduction of Copper Oxide Thin Films with Hydrogen Plasma Generated by a Dielectric-Barrier Glow Discharge , 1999 .

[45]  P. Schmid,et al.  Plasma deposition of Si-N and Si-O passivation layers on three-dimensional sensor devices , 1998 .

[46]  Y. Waseda,et al.  Native Oxide Layers Formed on the Surface of Ultra High-Purity Iron and Copper Investigated by Angle Resolved XPS , 1997 .

[47]  Stephen Poulston,et al.  Surface Oxidation and Reduction of CuO and Cu2O Studied Using XPS and XAES , 1996 .

[48]  K. Hashimoto,et al.  The reduction of copper oxide thin films with hydrogen plasma generated by an atmospheric-pressure glow discharge , 1996 .

[49]  M. Kogoma,et al.  A New Approach to the Copper/Epoxy Joint Using Atmospheric Pressure Glow Discharge , 1995 .

[50]  C. Ting,et al.  Selective electroless copper for VLSI interconnection , 1989, IEEE Electron Device Letters.

[51]  Robert P. Wei,et al.  Gaseous hydrogen embrittlement of high strength steels , 1977 .

[52]  Y. Jugnet,et al.  X-ray photoelectron spectroscopy of thermally grown silicon dioxide films on silicon , 1975 .