ROIC development at CEA for SWIR detectors: pixel circuit architecture and trade-offs

Infrared detection is widely used in astrophysics and plays a key role in several space missions aiming for example at scanning the sky to discover new objects (coolest stars, dust-obscured galaxies, exo-planets …) or studying the evolution of the universe, where light is redshifted in the infrared range. In many cases the space telescope involves an HgCdTe infrared detector operating at low frame rate over long integration time. Due to the very low input signal, dark current and readout noise are essential figures that must be minimized to get the best detector sensitivity. This kind of application also requires very large focal plane array (FPA) often relying on a butting arrangement of large detectors. The trend is to increase the single detector format from 1Kx1K to 2Kx2K and 4Kx4K. For very large formats, material quality and detector process may affect the production yield and the global infrared FPA cost. As a result the detector format could result from a trade-off taking into account producibility.

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