A general and efficient computational procedure for modelling the Kapitza thermal resistance based on XFEM
暂无分享,去创建一个
Julien Yvonnet | Qi-Chang He | Jian-Fu Shao | J. Shao | J. Yvonnet | Qi-Zhi Zhu | Q. Zhu | Q. He
[1] C. Nan,et al. Effective thermal conductivity of particulate composites with interfacial thermal resistance , 1997 .
[2] C. Toulemonde,et al. Numerical modelling of the effective conductivities of composites with arbitrarily shaped inclusions and highly conducting interface , 2008 .
[3] Georgios I. Giannopoulos,et al. A BEM analysis for thermomechanical closure of interfacial cracks incorporating friction and thermal resistance , 2007 .
[4] L. Challis. Kapitza resistance and acoustic transmission across boundaries at high frequencies , 1974 .
[5] Ted Belytschko,et al. A finite element method for crack growth without remeshing , 1999 .
[6] David L. McDowell,et al. Numerical analysis of the transverse thermal conductivity of composites with imperfect interfaces , 2003 .
[7] E. Hervé. Thermal and thermoelastic behaviour of multiply coated inclusion-reinforced composites , 2002 .
[8] G. Mahan,et al. Kapitza thermal resistance between a metal and a nonmetal , 2009 .
[9] R. O. Pohl,et al. Thermal resistance at interfaces , 1987 .
[10] S. Osher,et al. Algorithms Based on Hamilton-Jacobi Formulations , 1988 .
[11] Ted Belytschko,et al. Elastic crack growth in finite elements with minimal remeshing , 1999 .
[12] T. Belytschko,et al. MODELING HOLES AND INCLUSIONS BY LEVEL SETS IN THE EXTENDED FINITE-ELEMENT METHOD , 2001 .
[13] Ted Belytschko,et al. Structured extended finite element methods for solids defined by implicit surfaces , 2002 .
[14] A. Majumdar,et al. Nanoscale thermal transport , 2003, Journal of Applied Physics.
[15] J. Sethian,et al. Fronts propagating with curvature-dependent speed: algorithms based on Hamilton-Jacobi formulations , 1988 .
[16] Rintoul,et al. Effect of the interface on the properties of composite media. , 1995, Physical review letters.
[17] H. Maris,et al. Kapitza conductance and heat flow between solids at temperatures from 50 to 300 K. , 1993, Physical review. B, Condensed matter.