A microspray-based cooling system for high powered LEDs

Abstract We propose a microspray-based cooling system for the thermal management of high-power, light emitting diodes (LEDs). Experiments were performed by applying a single microspray to a single and a four LED system. The spray exited the nozzle using piezo-electric micropumping. The effect of cooling in a non-boiling regime was quantitatively studied within a range of relevant operating parameters. Furthermore, both μPIV flow visualizations, infrared thermal image observation and flow field measurements were first made to investigate the heat transfer mechanisms involved in this complex process.

[1]  Lianqiao Yang,et al.  Thermal analysis of high power GaN-based LEDs with ceramic package , 2007 .

[2]  Wei Chen,et al.  Experimental and Numerical Investigation of a Microjet-Based Cooling System for High Power LEDs , 2008 .

[3]  Xiaobing Luo,et al.  Low thermal resistance LED light source with vapor chamber coupled fin heat sink , 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

[4]  J. Petroski,et al.  Spacing of high-brightness LEDs on metal substrate PCB's for proper thermal performance , 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

[5]  N. Narendran,et al.  Life of LED-based white light sources , 2005, Journal of Display Technology.

[6]  Yan-Ping Wang,et al.  Thermal analysis of high power LED package with heat pipe heat sink , 2011, Microelectron. J..

[7]  Jong Hwa Choi,et al.  Thermal analysis of LED array system with heat pipe , 2007 .