Three-Dimensional Interconnection With Magnetically Coupled Transition for W-Band Integration Applications

In this article, a new class of 3-D interconnection with the magnetically coupled transition is proposed at <inline-formula> <tex-math notation="LaTeX">$W$ </tex-math></inline-formula>-band. In contrast to planar approaches, it can connect different components or modules in a complex package with wideband and low-loss performance, even if in separate circuit boards. To overcome the radiation loss, the micromachined rectangular microcoaxial line (<inline-formula> <tex-math notation="LaTeX">$\text{R}\mu $ </tex-math></inline-formula>CL) is chosen to be the 3-D signal line, owing to its low-weight robust structure and low-crosstalk transmission. The substrate integrated waveguide (SIW) is chosen to act as the common signal line around the components and modules. The soldering process will introduce the unpredictable parasitic reactance, which can deteriorate the transmission performance. To construct a nonsoldering field transformation structure from the TEM mode to the TE10 mode, the U-shaped magnetic slot is etched on the SIW through the direction orthogonal to the current field vector, and the tail of the <inline-formula> <tex-math notation="LaTeX">$\text{R}\mu $ </tex-math></inline-formula>CL is directly open. Meanwhile, the transmission characteristics is studied by analyzing the physics-based equivalent-circuit model of this interconnection. The extraction methods of the key parameters, such as turn ratios in the equivalent circuit, are studied for simplifying the synthesis approach. A back-to-back interconnection prototype is designed by the synthesis guideline. The prototypes are fabricated and measured to validate the correctness of this design. The measured results show that the proposed transition achieves a bandwidth from 85 to 100 GHz with the return loss better than 13 dB and the insertion loss around 1.5 dB, which make it promising for high-density interconnection applications at <inline-formula> <tex-math notation="LaTeX">$W$ </tex-math></inline-formula>-band.

[1]  C. Waldschmidt,et al.  Glass Package for Radar MMICs Above 150 GHz , 2022, IEEE Journal of Microwaves.

[2]  J. Tarng,et al.  Millimeter-Wave 2-D Beam-Switchable and Scalable Phased Antenna Array , 2021, IEEE Transactions on Antennas and Propagation.

[3]  Yong Fan,et al.  Planar Ultra-Wideband and Wide-Scanning Dual-Polarized Phased Array With Integrated Coupled-Marchand Balun for High Polarization Isolation and Low Cross-Polarization , 2021, IEEE Transactions on Antennas and Propagation.

[4]  Shilin Yang,et al.  A Low-Loss Broadband Planar Transition From Ground Coplanar Waveguide to Substrate-Integrated Coaxial Line , 2021, IEEE Microwave and Wireless Components Letters.

[5]  Junhong Wang,et al.  Millimeter-Wave Three-Dimensional Substrate-Integrated OMT-Fed Horn Antenna Using Vertical and Planar Groove Gap Waveguides , 2021, IEEE Transactions on Microwave Theory and Techniques.

[6]  Zhi Ning Chen,et al.  Dual-Band Miniaturized Linear-to-Circular Metasurface Polarization Converter With Wideband and Wide-Angle Axial Ratio , 2021, IEEE Transactions on Antennas and Propagation.

[7]  P. Xiao,et al.  High-Gain Phased Array Antenna With Endfire Radiation for 26 GHz Wide-Beam-Scanning Applications , 2021, IEEE Transactions on Antennas and Propagation.

[8]  Hao-Ran Zhu,et al.  A Novel Vertical Wire-Bonding Compensation Structure Adaptively Modeled and Optimized With GRNN and GA Methods for System in Package , 2021, IEEE Transactions on Electromagnetic Compatibility.

[9]  Jin Xu,et al.  A 10–50-GHz UWB BPF With GSG Probe Transition Using Micromachined Rectangular Microcoaxial Line , 2021, IEEE Transactions on Microwave Theory and Techniques.

[10]  M. Limbach,et al.  Compact Ultrawideband Grounded Coplanar Waveguide to Substrate Integrated Waveguide Tapered V-Slot Transition , 2020, IEEE Microwave and Wireless Components Letters.

[11]  Y. Cheng,et al.  A Tri-Band Shared-Aperture Antenna for (2.4, 5.2) GHz Wi-Fi Application With MIMO Function and 60 GHz Wi-Gig Application With Beam-Scanning Function , 2020, IEEE Transactions on Antennas and Propagation.

[12]  F. Ellinger,et al.  Direct Chip-to-Waveguide Transition Realized With Wire Bonding for 140–220 GHz G-Band , 2020, IEEE Transactions on Terahertz Science and Technology.

[13]  R. White,et al.  Co-Fabrication of Microcoaxial Interconnects and Substrate Junctions for Multichip Microelectronic Systems , 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[14]  Yi Wang,et al.  A 3-D Printed $E$ -Plane Waveguide Magic-T Using Air-Filled Coax-to-Waveguide Transitions , 2019, IEEE Transactions on Microwave Theory and Techniques.

[15]  Herbert Zirath,et al.  Toward Industrial Exploitation of THz Frequencies: Integration of SiGe MMICs in Silicon-Micromachined Waveguide Systems , 2019, IEEE Transactions on Terahertz Science and Technology.

[16]  Martin Vossiek,et al.  Additively Manufactured Dielectric Waveguides for Advanced Concepts for Millimeter-Wave Interconnects , 2019, IEEE Transactions on Microwave Theory and Techniques.

[17]  Junfa Mao,et al.  An Overview of the Development of Antenna-in-Package Technology for Highly Integrated Wireless Devices , 2019, Proceedings of the IEEE.

[18]  Shahriar Shahramian,et al.  A Fully Integrated 384-Element, 16-Tile, $W$ -Band Phased Array With Self-Alignment and Self-Test , 2019, IEEE Journal of Solid-State Circuits.

[19]  I. Monroy,et al.  System Integration and Packaging of a Terahertz Photodetector at $W$ -Band , 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[20]  Yu Jian Cheng,et al.  Single-Layer Dual-Band Linear-to-Circular Polarization Converter With Wide Axial Ratio Bandwidth and Different Polarization Modes , 2019, IEEE Transactions on Antennas and Propagation.

[21]  A. Kouki,et al.  Vertical LTCC Integrated Rectangular Waveguide and Transitions for Millimeter-Wave Applications , 2019, IEEE Transactions on Microwave Theory and Techniques.

[22]  Hao Wang,et al.  Novel $W$ -Band LTCC Transition From Microstrip Line to Ridge Gap Waveguide and its Application in 77/79 GHz Antenna Array , 2019, IEEE Transactions on Antennas and Propagation.

[23]  Abdelrazik Sebak,et al.  Broadband Transition of Substrate-Integrated Waveguide-to-Air-Filled Rectangular Waveguide , 2018, IEEE Microwave and Wireless Components Letters.

[24]  J. Hesselbarth,et al.  Building Blocks for a Millimeter-Wave Multiport Multicast Chip-to-Chip Interconnect Based on Dielectric Waveguides , 2018, IEEE Transactions on Microwave Theory and Techniques.

[25]  Yang Tian,et al.  On-Chip Air-Gapped Cavity Resonators and Filters for mm-Wave IC Applications , 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[26]  Martin Schneider,et al.  90 Degree Microstrip to Rectangular Dielectric Waveguide Transition in the W-Band , 2016, IEEE Microwave and Wireless Components Letters.

[27]  N. Zhu,et al.  Three-Dimensional Package Design for Electro-Absorption Modulation Laser Array , 2016, IEEE Photonics Journal.

[28]  Wei Hong,et al.  A Wire Bonding Structure Directly Based on Substrate Integrated Waveguide Technology , 2014, IEEE Microwave and Wireless Components Letters.

[29]  Rui Li,et al.  Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration , 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[30]  Ke Wu,et al.  Three-Dimensional Architecture of Substrate Integrated Waveguide Feeder for Fermi Tapered Slot Antenna Array Applications , 2012, IEEE Transactions on Antennas and Propagation.

[31]  Ke Wu,et al.  Substrate-Integrated Waveguide Vertical Interconnects for 3-D Integrated Circuits , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[32]  Ke-Li Wu,et al.  A Broadband U-Slot Coupled Microstrip-to-Waveguide Transition , 2012, IEEE Transactions on Microwave Theory and Techniques.

[33]  A. Tessmann,et al.  Security Pre-screening of Moving Persons Using a Rotating Multichannel $W$ -Band Radar , 2012, IEEE Transactions on Microwave Theory and Techniques.

[34]  N Ehsan,et al.  Micro-Coaxial Impedance Transformers , 2010, IEEE Transactions on Microwave Theory and Techniques.

[35]  N. S. Barker,et al.  A Waveguide to Unenclosed Coplanar Waveguide Transition , 2010, IEEE Transactions on Microwave Theory and Techniques.

[36]  Z.B. Popovic,et al.  Broadband Micro-Coaxial Wilkinson Dividers , 2009, IEEE Transactions on Microwave Theory and Techniques.

[37]  Sungwook Moon,et al.  Novel Three-Dimensional Packaging Approaches Using Magnetically Aligned Anisotropic Conductive Adhesive for Microwave Applications , 2008, IEEE Transactions on Microwave Theory and Techniques.

[38]  Hai-Young Lee,et al.  Ultra-Wideband CPW-to-Substrate Integrated Waveguide Transition Using an Elevated-CPW Section , 2008, IEEE Microwave and Wireless Components Letters.

[39]  D. Filipović,et al.  Monolithic Rectangular Coaxial Lines and Resonators With Embedded Dielectric Support , 2008, IEEE Microwave and Wireless Components Letters.

[40]  Ke Wu,et al.  Substrate Integrated Waveguide-to-Microstrip Transition in Multilayer Substrate , 2007, IEEE Transactions on Microwave Theory and Techniques.

[41]  J. R. Reid,et al.  Gold-Plated Micromachined Millimeter-Wave Resonators Based on Rectangular Coaxial Transmission Lines , 2007, IEEE Transactions on Microwave Theory and Techniques.

[42]  Z. Popovic,et al.  Quasi-planar high-Q millimeter-wave resonators , 2006, IEEE Transactions on Microwave Theory and Techniques.

[43]  Ramakrishna Janaswamy,et al.  Characteristic Impedance of a Wide Slotline on Low-Permittivity Substrates (Short Paper) , 1986 .

[44]  N. Fonseca,et al.  Substrate Integrated Transmission Lines: Review and Applications , 2021, IEEE Journal of Microwaves.

[45]  N. Weimann,et al.  Connecting Chips With More Than 100 GHz Bandwidth , 2021, IEEE Journal of Microwaves.

[46]  Qun Jane Gu,et al.  High-Efficiency Micromachined Sub-THz Channels for Low-Cost Interconnect for Planar Integrated Circuits , 2016, IEEE Transactions on Microwave Theory and Techniques.

[47]  Ke Wu,et al.  Substrate Integrated Waveguide Directional Couplers for Compact Three-Dimensional Integrated Circuits , 2015, IEEE Transactions on Microwave Theory and Techniques.

[48]  E. S. Li,et al.  Full W -band Waveguide-to-microstrip Transition With New E-plane Probe , 2013, IEEE Microwave and Wireless Components Letters.

[49]  Jia-Sheng Hong,et al.  Microstrip filters for RF/microwave applications , 2001 .