Predictive reliability models through validated correlation between power cycling and thermal cycling accelerated life tests

Aims to show that with careful modelling, the fatigue life of solder joints of identical geometry and microstructure can be predicted very accurately (through empirical correlations) under different environmental test or field use conditions. Here, on the TI 144 chip ‐scale package, the empirical correlation for fatigue life developed under thermal cycling conditions is used to predict the life under power cycling. This accurate model has served as the physical basis which in to demonstrate quantitatively the equivalence of thermal cycling and power cycling as valid accelerated life tests. Describes the great importance of spatial refinement, temporal refinement, and accurate boundary conditions, including the often ignored natural convection boundary conditions, and their effect on predicted life.

[1]  Ganesh Subbarayan,et al.  A System for First Order Reliability Estimation of Solder Joints in Area Array Packages , 1998, Manufacturing Science and Engineering.

[2]  Bahgat Sammakia,et al.  Buoyancy-Induced Flows and Transport , 1988 .

[3]  Ralph Remsburg.  Thermal Design of Electronic Equipment , 2000 .

[4]  K. Schittkowski.  NLPQL: A fortran subroutine solving constrained nonlinear programming problems , 1986 .

[5]  J.-P.M. Clech,et al.  Surface mount assembly failure statistics and failure free time , 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

[6]  Cemal Basaran,et al.  A Thermodynamic Framework for Damage Mechanics of Solder Joints , 1998 .

[7]  S.A. McKeown,et al.  Energy-based methodology for the fatigue-life prediction of solder materials , 1991, 1991 Proceedings 41st Electronic Components & Technology Conference.

[8]  Roop L. Mahajan,et al.  Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models , 1996 .

[9]  G. Delarozee,et al.  Introduction to reliability , 1999 .

[10]  Elmer E Lewis,et al.  Introduction To Reliability Engineering , 1987 .

[11]  S. Lee,et al.  A Damage Evolution Model for Thermal Fatigue Analysis of Solder Joints , 2000 .

[12]  P. Towashiraporn,et al.  A hybrid fracture-damage model for computationally efficient fracture simulations in solder joints , 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).