Localized statistical 3D thermal analysis considering Electro-Thermal coupling
暂无分享,去创建一个
[1] Sachin S. Sapatnekar,et al. Electrothermal analysis and optimization techniques for nanoscale integrated circuits , 2006, Asia and South Pacific Conference on Design Automation, 2006..
[2] Martin D. F. Wong,et al. Fast algorithms for IR drop analysis in large power grid , 2005, ICCAD-2005. IEEE/ACM International Conference on Computer-Aided Design, 2005..
[3] R.P. Dick,et al. Adaptive multi-domain thermal modeling and analysis for integrated circuit synthesis and design , 2006, 2006 IEEE/ACM International Conference on Computer Aided Design.
[4] Chung-Kuan Cheng,et al. Area minimization of power distribution network using efficient nonlinear programming techniques , 2001, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.
[5] Martin D. F. Wong,et al. Fast block-iterative domain decomposition algorithm for IR drop analysis in large power grid , 2010, 2010 11th International Symposium on Quality Electronic Design (ISQED).
[6] Nihar R. Mahapatra,et al. An Analysis of Timing Violations Due to Spatially Distributed Thermal Effects in Global Wires , 2007, 2007 44th ACM/IEEE Design Automation Conference.
[7] Peng Li. Variational analysis of large power grids by exploring statistical sampling sharing and spatial locality , 2005, ICCAD-2005. IEEE/ACM International Conference on Computer-Aided Design, 2005..
[8] Charlie Chung-Ping Chen,et al. 3D thermal-ADI: an efficient chip-level transient thermal simulator , 2003, ISPD '03.
[9] Sung-Mo Kang,et al. Cell-level placement for improving substrate thermal distribution , 2000, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..
[10] K. Banerjee,et al. An Electrothermally-Aware Full-Chip Substrate Temperature Gradient Evaluation Methodology for Leakage Dominant Technologies with Implications for Power Estimation and Hot-Spot Management , 2006, 2006 IEEE/ACM International Conference on Computer Aided Design.
[11] Sachin S. Sapatnekar,et al. A high efficiency full-chip thermal simulation algorithm , 2005, ICCAD-2005. IEEE/ACM International Conference on Computer-Aided Design, 2005..