Interfacial reliability between hot-melt polyamides resin and textile for wearable electronics application

Abstract The interfacial reliability between hot-melt polyamides resin and textile is studied to investigate whether hot-melt polyamides resin is useful as an encapsulation material of wearable electronic devices. Four kinds of hot-melt polyamides resins and six kinds of textile fabrics are used, and the test sample is fabricated by molding polyamides resin on top of textile. To confirm the mechanical reliability between polyamides resin and textile under water washing and dry cleaning condition, the adhesion strength is measured by 90° peel test not only at initial state but also after exposing the sample to moisture and heat. As a result, it can be seen after high temperature and humidity test that peel strength is degraded and fracture mode can be changed from adhesive failure to cohesive failure according to textile fabric. Also, the optimal combination of polyamides resin and textile for better peel strength is obtained.

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