Analysis and Design of Helix-on-Pads for Miniaturized Mobile Applications
暂无分享,去创建一个
[1] Xiaolin Zhao,et al. Modeling, optimization and performance of high-Q MEMS solenoid inductors , 2007 .
[2] I. Bahl. Lumped Elements for RF and Microwave Circuits , 2003 .
[3] Yong-Goo Lee,et al. Novel high-Q bondwire inductor for MMIC , 1998, International Electron Devices Meeting 1998. Technical Digest (Cat. No.98CH36217).
[4] Xiaodong Liu,et al. A 0.1–5.0 GHz Reconfigurable Transmitter With Dual-Mode Power Amplifier and Digitally-Assisted Self-Calibration for Private Network Communications , 2014, IEEE Transactions on Circuits and Systems I: Regular Papers.
[5] Chul Nam,et al. A High Performance Solenoid-Type MEMS Inductor , 2001 .
[6] Dok Won Lee,et al. Design and fabrication of integrated solenoid inductors with magnetic cores , 2008, 2008 58th Electronic Components and Technology Conference.
[7] Zhihua Wang,et al. An efficiency-enhanced 2.4GHz stacked CMOS power amplifier with mode switching scheme for WLAN applications , 2014, Proceedings of the IEEE 2014 Custom Integrated Circuits Conference.
[8] T. Takahashi,et al. Integrated Passives on LTCC for Achieving Chip-Sized-Modules , 2008, 2008 38th European Microwave Conference.
[10] Wei Hong,et al. Suppression of Second and Third Harmonics Using $\lambda/$4 Low-Impedance Substrate IntegratedWaveguide Bias Line in Power Amplifier , 2008, IEEE Microwave and Wireless Components Letters.
[11] A. J. Wilkinson,et al. Transmission-line load-network topology for class-E power amplifiers , 2001 .
[12] Sarah Kuester,et al. Microwave Solid State Circuit Design , 1988 .
[13] D. D. Grieg,et al. Microstrip-A New Transmission Technique for the Klilomegacycle Range , 1952, Proceedings of the IRE.
[14] Ling Sun,et al. Modeling and Parameter Extraction Methods of Bond-Wires for Chip-Package Co-Design , 2006, 2006 7th International Conference on Electronic Packaging Technology.
[15] Youngwoo Kwon,et al. A Fully-Integrated Penta-Band Tx Reconfigurable Power Amplifier with SOI CMOS Switches for Mobile Handset Applications , 2014 .
[16] E. Beyne,et al. Compact broadband resistance model for microstrip transmission lines , 2004, Electrical Performance of Electronic Packaging - 2004.
[17] Youngwoo Kwon,et al. A Multiband Reconfigurable Power Amplifier for UMTS Handset Applications , 2010, IEEE Transactions on Microwave Theory and Techniques.
[18] Choon Beng Sia,et al. Physical layout design optimization of integrated spiral inductors for silicon-based RFIC applications , 2005, IEEE Transactions on Electron Devices.
[19] Yoshihiro Hayashi,et al. A low-power, small area quadrature LC-VCO using miniature 3D solenoid shaped inductor , 2009, 2009 IEEE Radio Frequency Integrated Circuits Symposium.
[20] 이해영,et al. 본딩와이어를 이용한 MMIC용 고품질 수직형 인덕터 ( Novel High-Q Vertical Inductor Using Bondwires for MMICs ) , 1997 .
[21] G. Hau,et al. A 3x3mm2 embedded-wafer-level packaged WCDMA GaAs HBT power amplifier module with integrated Si DC power management IC , 2008, 2008 IEEE Radio Frequency Integrated Circuits Symposium.
[22] Hsin-Chia Lu,et al. LTCC Spiral Inductor Synthesis and Optimization With Measurement Verification , 2010, IEEE Transactions on Advanced Packaging.
[23] C.S. Lin,et al. A deep submicrometer CMOS process compatible high-Q air-gap solenoid inductor with laterally laid structure , 2005, IEEE Electron Device Letters.
[24] Y. Kwon,et al. Helix on Pad-Type Ultra Small-Size Power Amplifiers for WCDMA Handset Applications , 2009, IEEE Microwave and Wireless Components Letters.
[25] M. A. R. Gunston. Microwave transmission-line impedance data , 1972 .
[26] E. B. Rosa,et al. Formulae and Tables for the Calculation of Mutual and Self-Inductance , 2017 .
[27] H. R. Kaupp,et al. Characteristics of Microstrip Transmission Lines , 1967, IEEE Trans. Electron. Comput..
[28] Youngwoo Kwon,et al. Fully Integrated HBT MMIC Series‐Type Extended Doherty Amplifier for W‐CDMA Handset Applications , 2010 .
[29] J. Maxwell. A Treatise on Electricity and Magnetism , 1873, Nature.
[30] R. H. Caverly. Characteristic Impedance of Integrated Circuit Bond Wires (Short Paper) , 1986 .
[31] C. Liao,et al. A Physical Model of Solenoid Inductors on Silicon Substrates , 2007, IEEE Transactions on Microwave Theory and Techniques.
[32] M. Nishida,et al. A novel design concept for a super compact power amplifier module (SCPAM) using a multilayer substrate , 1999, 1999 IEEE MTT-S International Microwave Symposium Digest (Cat. No.99CH36282).
[33] Baoyong Chi,et al. An Efficiency-Enhanced Stacked 2.4-GHz CMOS Power Amplifier With Mode Switching Scheme for WLAN Applications , 2015, IEEE Transactions on Microwave Theory and Techniques.
[34] E. B. Rosa,et al. Formulas and tables for the calculation of mutual and self-inductance (Revised) , 1912 .
[36] Xinxin Li,et al. High-$Q$ Solenoid Inductors With a CMOS-Compatible Concave-Suspending MEMS Process , 2007, Journal of Microelectromechanical Systems.
[37] R. Weigel,et al. Broadband high-efficiency monolithic InGaP/GaAs HBT power amplifiers for 3G handset applications , 2002, 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).
[38] Daniel C. Edelstein,et al. Spiral inductors and transmission lines in silicon technology using copper-damascene interconnects and low-loss substrates , 1997 .
[39] Junghyun Kim,et al. Ultra-small Form-Factor Helix on Pad-Type Stage-Bypass WCDMA Tx Power Amplifier Using a Chip-Stacking Technique and a Multilayer Substrate , 2010 .
[40] Jian Lu,et al. Modeling, Design, and Characterization of Multiturn Bondwire Inductors With Ferrite Epoxy Glob Cores for Power Supply System-on-Chip or System-in-Package Applications , 2010, IEEE Transactions on Power Electronics.