Mechanisms for Grip-and-Release Process of Adhesion Contact Using Material with Variable Elastic Modulus
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Y. Sekiguchi | Kunio Takahashi | K. Takahashi | L. Lei | Pasomphone Hemthavy | Y. Sekiguchi | P. Hemthavy
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Y. Sekiguchi | Kunio Takahashi | K. Takahashi | L. Lei | Pasomphone Hemthavy | Y. Sekiguchi | P. Hemthavy