On the thermal stability margins of high-leakage current packaged devices
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[1] Steven C. Chapra,et al. Numerical Methods for Engineers , 1986 .
[2] B. M. Guenin,et al. Analysis of a thermally enhanced ball grid array package , 1995, Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).
[3] Steven C. Chapra,et al. Numerical methods for engineers: with software and programming applications / Steven C. Chapra, Raymond P. Canale , 2001 .
[4] Mircea R. Stan,et al. System level leakage reduction considering the interdependence of temperature and leakage , 2004, Proceedings. 41st Design Automation Conference, 2004..
[5] Ali Keshavarzi,et al. Thermal management of high performance microprocessors in burn-in environment , 2003, Proceedings 18th IEEE Symposium on Defect and Fault Tolerance in VLSI Systems.
[6] Atsushi Ishiyama,et al. A stability criterion for cryocooler-cooled HTS coils , 2001 .
[7] Stephen J. Finney,et al. Thermal stability of IGBT high-frequency operation , 2000, IEEE Trans. Ind. Electron..
[8] B. A. Zahn,et al. Evaluation of isothermal and isoflux natural convection coefficient correlations for utilization in electronic package level thermal analysis , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.
[9] O. Semenov,et al. CMOS IC technology scaling and its impact on burn-in , 2004, IEEE Transactions on Device and Materials Reliability.