Antenna protection strategy for ultra-thin gate MOSFETs
暂无分享,去创建一个
We compare the efficacy of drain-well diodes and gated diodes as antenna protection under positive as well as negative plasma damage for gate oxides down to 21 /spl Aring/. Our results indicate that a nominal drain/substrate p-n junction (0.49 /spl mu/m/sup 2/) is capable of device protection for antennas up to 100k /spl mu/m, and can be extended down to 21 /spl Aring/ devices. We also present here novel protection schemes using (1) plasma UV exposed n-well-to-substrate diodes, and (2) a transient fuse for device protection against latent antenna damage.
[1] C. Hu,et al. Impact of plasma charging damage and diode protection on scaled thin oxide , 1993, Proceedings of IEEE International Electron Devices Meeting.
[2] J. McVittie,et al. Thin-oxide damage from gate charging during plasma processing , 1992, IEEE Electron Device Letters.
[3] Koichi Hashimoto,et al. New Phenomena of Charge Damage in Plasma Etching: Heavy Damage Only through Dense-Line Antenna , 1993 .