论文信息 - Effects of BEOL copper CMP process on TDDB for direct polishing ultra-low k dielectric cu interconnects at 28nm technology node and beyond - 字舞流文

Effects of BEOL copper CMP process on TDDB for direct polishing ultra-low k dielectric cu interconnects at 28nm technology node and beyond

J. Y. Wu | Y. M. Lin | C. H. Chen | Y. Hsieh | C. -. Lin | C. Hsu | H. Hsu | R. P. Huang | W. Lin | K. Liu | W. Tsao | Y. H. Su | C. Huang